EP2AGX125DF25I3G
EP2AGX125DF25I3G
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Intel Corporation

EP2AGX125DF25I3G


EP2AGX125DF25I3G
F18-EP2AGX125DF25I3G
Active
IC FPGA 260 I/O 572FBGA
572-FBGA, FC (25x25)

EP2AGX125DF25I3G ECAD Model


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EP2AGX125DF25I3G Attributes


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EP2AGX125DF25I3G Overview



The EP2AGX125DF25I3G chip model is a highly advanced chip model designed for use in a variety of applications, ranging from communication systems to networks and intelligent scenarios. It is designed to provide superior performance and reliability, as well as a high degree of flexibility. It is also designed to be energy efficient and cost-effective, making it an ideal choice for a variety of applications.


The EP2AGX125DF25I3G chip model has a number of advantages. It is an ultra-low power device, capable of operating at very low power levels, making it an ideal choice for battery-powered applications. It also has a high level of integration, allowing it to be used in a variety of applications. Additionally, it is capable of supporting a wide range of communication protocols, making it ideal for use in advanced communication systems.


The EP2AGX125DF25I3G chip model is expected to experience a high level of demand in the future, as it is a highly efficient and cost-effective solution for a variety of applications. It is also expected to experience a high degree of flexibility, due to its ability to support a wide range of communication protocols. Additionally, its energy efficiency makes it an ideal choice for battery-powered applications.


The EP2AGX125DF25I3G chip model is also designed to be easily upgradable, allowing for future upgrades and changes to be made quickly and easily. This makes it an ideal choice for applications that require frequent upgrades or changes. Additionally, it is designed to be compatible with a wide range of communication protocols, making it an ideal choice for advanced communication systems.


The EP2AGX125DF25I3G chip model is also capable of being used in a variety of network applications and intelligent scenarios. It is capable of supporting a wide range of communication protocols, making it ideal for use in networks. Additionally, its high level of integration allows it to be used in a variety of intelligent scenarios, such as machine learning, artificial intelligence, and natural language processing.


The EP2AGX125DF25I3G chip model is also capable of being used in the era of fully intelligent systems. Its high level of integration allows it to be used in a variety of intelligent scenarios, such as machine learning, artificial intelligence, and natural language processing. Additionally, its energy efficiency makes it an ideal choice for applications that require frequent upgrades or changes.


In conclusion, the EP2AGX125DF25I3G chip model is a highly advanced chip model designed for use in a variety of applications. It is designed to provide superior performance and reliability, as well as a high degree of flexibility and energy efficiency. It is expected to experience a high level of demand in the future, as it is a highly efficient and cost-effective solution for a variety of applications. Additionally, it is designed to be easily upgradable, allowing for future upgrades and changes to be made quickly and easily. Finally, it is capable of being used in a variety of network applications and intelligent scenarios, as well as the era of fully intelligent systems.



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Unit Price: $6,393.1037
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $5,945.5864 $5,945.5864
10+ $5,881.6554 $58,816.5540
100+ $5,562.0002 $556,200.0219
1000+ $5,242.3450 $2,621,172.5170
10000+ $4,794.8278 $4,794,827.7750
The price is for reference only, please refer to the actual quotation!

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