EP2A40F672C9
EP2A40F672C9
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rohs

Intel Corporation

EP2A40F672C9


EP2A40F672C9
F18-EP2A40F672C9
Active
IC FPGA 492 I/O 672FBGA
672-FBGA (27x27)

EP2A40F672C9 ECAD Model


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EP2A40F672C9 Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred
Supply Voltage-Nom 1.5 V
Propagation Delay 2.05 ns
Number of Inputs 480
Number of Outputs 480
Number of Logic Cells 38400
Number of I/O Lines 492
Programmable Logic Type LOADABLE PLD
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 492 I/O
Output Function MACROCELL
Power Supplies 1.5,1.5/3.3 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B672
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 220
Number of Terminals 672
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA672,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.1 mm
Ihs Manufacturer ALTERA CORP
Part Package Code BGA
Package Description 27 X 27 MM, 1 MM PITCH, FINE LINE, BGA-672
Pin Count 672
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

EP2A40F672C9 Overview



The chip model EP2A40F672C9 is a highly advanced integrated circuit designed to meet the needs of the modern industry. It is a powerful, low-power, and cost-effective solution for industrial applications. This chip model is capable of providing a high degree of integration, as well as enabling the development of a wide range of applications.


The EP2A40F672C9 chip model has been designed to be used in a variety of industrial applications. It is capable of providing a wide range of features, including the ability to support a wide range of communication protocols, high-speed data transfer, and many other features. This chip model is also capable of providing a high degree of integration, as well as enabling the development of a wide range of applications.


The EP2A40F672C9 chip model is a versatile, advanced, and cost-effective solution for industrial applications. It is capable of providing a wide range of features, including the ability to support a wide range of communication protocols, high-speed data transfer, and many other features. This chip model is also capable of providing a high degree of integration, as well as enabling the development of a wide range of applications.


In terms of industry trends, the EP2A40F672C9 chip model is expected to continue to be used in a wide range of industrial applications, such as industrial automation, medical, and consumer electronics. Furthermore, the chip model is expected to be used in the development of future intelligent robots. In terms of technical talents, the EP2A40F672C9 chip model requires a wide range of technical skills, such as programming, hardware design, and software engineering.


In terms of the application environment, the EP2A40F672C9 chip model may require the support of new technologies, such as artificial intelligence, machine learning, and robotics. Furthermore, the chip model may require the development of new algorithms and programming languages to enable the development of new applications.


In conclusion, the EP2A40F672C9 chip model is a powerful, low-power, and cost-effective solution for industrial applications. It is capable of providing a wide range of features, including the ability to support a wide range of communication protocols, high-speed data transfer, and many other features. Furthermore, the chip model is expected to be used in the development of future intelligent robots, and may require the support of new technologies, such as artificial intelligence, machine learning, and robotics. In terms of technical talents, the EP2A40F672C9 chip model requires a wide range of technical skills, such as programming, hardware design, and software engineering.



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