EP2A40F1020C9
EP2A40F1020C9
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rohs

Intel Corporation

EP2A40F1020C9


EP2A40F1020C9
F18-EP2A40F1020C9
Active
LOADABLE PLD, 2.05 ns, CMOS, BGA, BGA1020,32X32,40
BGA, BGA1020,32X32,40

EP2A40F1020C9 ECAD Model


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EP2A40F1020C9 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Propagation Delay 2.05 ns
Number of Inputs 723
Number of Outputs 723
Number of Logic Cells 38400
Number of I/O Lines 735
Programmable Logic Type LOADABLE PLD
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 735 I/O
Output Function MACROCELL
Power Supplies 1.5,1.5/3.3 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B1020
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Number of Terminals 1020
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1020,32X32,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 33 mm
Length 33 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA1020,32X32,40
Reach Compliance Code compliant
ECCN Code 3A001.A.7.A
HTS Code 8542.39.00.01

EP2A40F1020C9 Datasheet Download


EP2A40F1020C9 Overview



The chip model EP2A40F1020C9 is a powerful and versatile chip developed by a leading semiconductor manufacturer. It is designed to meet the needs of a wide range of applications, including power control, data processing, communication, and industrial control systems. This chip is a multi-function integrated circuit that integrates many components and functions into a single package. It is suitable for a variety of communication systems, including high-speed Ethernet, Wi-Fi, and Bluetooth.


The industry trends of the chip model EP2A40F1020C9 are constantly changing. The chip is constantly being upgraded to meet the demands of the ever-evolving technology landscape. As new technologies become available, the chip model EP2A40F1020C9 may need to be upgraded to support these new technologies.


The original design intention of the chip model EP2A40F1020C9 is to provide an efficient, reliable, and cost-effective solution for a variety of applications. It is designed to be used in a wide range of communication systems, including high-speed Ethernet, Wi-Fi, and Bluetooth. The chip is also designed to be upgradable to meet the demands of the ever-changing technology landscape.


The product description of the chip model EP2A40F1020C9 includes its features, performance, and specifications. It is a multi-function integrated circuit that integrates many components and functions into a single package. It is designed to be used in a wide range of communication systems, including high-speed Ethernet, Wi-Fi, and Bluetooth. It is also designed to be upgradable to meet the demands of the ever-changing technology landscape.


In order to better understand the chip model EP2A40F1020C9 and its applications, it is important to review actual case studies and consider the precautions that must be taken when using the chip. These case studies can provide valuable insights into the chip's capabilities and its potential applications. Additionally, it is important to consider the safety and security implications of using the chip, as well as any potential compatibility issues with other components or systems.


In conclusion, the chip model EP2A40F1020C9 is a powerful and versatile chip that is designed to meet the needs of a wide range of applications. It is constantly being upgraded to meet the demands of the ever-evolving technology landscape. In order to better understand the chip model EP2A40F1020C9 and its applications, it is important to review actual case studies and consider the precautions that must be taken when using the chip.



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