
Intel Corporation
EP2A15F672C9N
EP2A15F672C9N ECAD Model
EP2A15F672C9N Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Propagation Delay | 2.23 ns | |
Number of Inputs | 480 | |
Number of Outputs | 480 | |
Number of Logic Cells | 16640 | |
Number of I/O Lines | 492 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 492 I/O | |
Output Function | MACROCELL | |
Power Supplies | 1.5,1.5/3.3 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B672 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Number of Terminals | 672 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA672,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.1 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA672,26X26,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
EP2A15F672C9N Datasheet Download
EP2A15F672C9N Overview
The chip model EP2A15F672C9N is an advanced chip model that has been developed to meet the increasing demand for high-performance computing and communication systems. It is a single-chip solution that integrates a wide range of features, including a powerful processor, a large memory, an advanced communication system, and a comprehensive set of peripherals. This chip model is capable of providing high-speed data transfer, reliable communication, and efficient data processing.
The original design intention of the chip model EP2A15F672C9N was to provide a powerful and reliable computing platform for a wide range of applications. It is designed to be highly flexible and adaptable to changing requirements, allowing users to easily upgrade and customize their hardware and software configurations. It is also capable of supporting a wide range of communication protocols and operating systems, making it suitable for a variety of applications.
The future development of the chip model EP2A15F672C9N will depend on the specific technologies that are needed to support the application environment. It is likely that new technologies will be needed to support the increasing demand for high-performance computing and communication systems. For example, the chip model may need to be upgraded to support new communication protocols, advanced security features, and more efficient data processing.
The chip model EP2A15F672C9N may also be applied to networks and intelligent scenarios in the future. It is likely that the chip model will be used in the era of fully intelligent systems, as it is capable of providing the necessary computing power and communication capabilities for such systems. The chip model is also capable of supporting a wide range of communication protocols, making it suitable for a variety of applications, including the Internet of Things (IoT).
In conclusion, the chip model EP2A15F672C9N has been designed to meet the increasing demand for high-performance computing and communication systems. It is capable of providing high-speed data transfer, reliable communication, and efficient data processing. The chip model is also capable of supporting a wide range of communication protocols, making it suitable for a variety of applications. The future development of the chip model will depend on the specific technologies that are needed to support the application environment, and it is likely that the chip model will be used in the era of fully intelligent systems.
You May Also Be Interested In
3,648 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
No reference price found. |