EP2A15F672C9N
EP2A15F672C9N
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rohs

Intel Corporation

EP2A15F672C9N


EP2A15F672C9N
F18-EP2A15F672C9N
Active
LOADABLE PLD, 2.23 ns, CMOS, BGA, BGA672,26X26,40
BGA, BGA672,26X26,40

EP2A15F672C9N ECAD Model


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EP2A15F672C9N Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Propagation Delay 2.23 ns
Number of Inputs 480
Number of Outputs 480
Number of Logic Cells 16640
Number of I/O Lines 492
Programmable Logic Type LOADABLE PLD
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 492 I/O
Output Function MACROCELL
Power Supplies 1.5,1.5/3.3 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B672
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Number of Terminals 672
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA672,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.1 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA672,26X26,40
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

EP2A15F672C9N Datasheet Download


EP2A15F672C9N Overview



The chip model EP2A15F672C9N is an advanced chip model that has been developed to meet the increasing demand for high-performance computing and communication systems. It is a single-chip solution that integrates a wide range of features, including a powerful processor, a large memory, an advanced communication system, and a comprehensive set of peripherals. This chip model is capable of providing high-speed data transfer, reliable communication, and efficient data processing.


The original design intention of the chip model EP2A15F672C9N was to provide a powerful and reliable computing platform for a wide range of applications. It is designed to be highly flexible and adaptable to changing requirements, allowing users to easily upgrade and customize their hardware and software configurations. It is also capable of supporting a wide range of communication protocols and operating systems, making it suitable for a variety of applications.


The future development of the chip model EP2A15F672C9N will depend on the specific technologies that are needed to support the application environment. It is likely that new technologies will be needed to support the increasing demand for high-performance computing and communication systems. For example, the chip model may need to be upgraded to support new communication protocols, advanced security features, and more efficient data processing.


The chip model EP2A15F672C9N may also be applied to networks and intelligent scenarios in the future. It is likely that the chip model will be used in the era of fully intelligent systems, as it is capable of providing the necessary computing power and communication capabilities for such systems. The chip model is also capable of supporting a wide range of communication protocols, making it suitable for a variety of applications, including the Internet of Things (IoT).


In conclusion, the chip model EP2A15F672C9N has been designed to meet the increasing demand for high-performance computing and communication systems. It is capable of providing high-speed data transfer, reliable communication, and efficient data processing. The chip model is also capable of supporting a wide range of communication protocols, making it suitable for a variety of applications. The future development of the chip model will depend on the specific technologies that are needed to support the application environment, and it is likely that the chip model will be used in the era of fully intelligent systems.



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