Intel Corporation
EP2A15F672C9
EP2A15F672C9 ECAD Model
EP2A15F672C9 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.5 V | |
| Propagation Delay | 2.23 ns | |
| Number of Inputs | 480 | |
| Number of Outputs | 480 | |
| Number of Logic Cells | 16640 | |
| Number of I/O Lines | 492 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 492 I/O | |
| Output Function | MACROCELL | |
| Power Supplies | 1.5,1.5/3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | 27 X 27 MM, 1 MM PITCH, FINE LINE, BGA-672 | |
| Pin Count | 672 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
EP2A15F672C9 Overview
The chip model EP2A15F672C9 is a highly advanced and reliable chip model developed by the semiconductor giant Intel. It is designed to provide a high-level of performance and reliability for a wide range of applications. It is a single-chip solution for advanced communication systems, providing a low-power, high-performance, and cost-effective solution for today's data-intensive communication systems.
The EP2A15F672C9 is a highly integrated and versatile chip model that offers a wide range of features, including support for multiple communication protocols, advanced security features, and advanced power management. It is designed to be used in a variety of applications, including wireless communication systems, data centers, and enterprise networks. It is also capable of supporting a variety of network speeds, from 10 Mbps to 10 Gbps, and supports a wide range of features, such as Quality of Service (QoS), power management, and advanced security features.
In terms of industry trends, the EP2A15F672C9 is expected to remain popular in the future due to its high performance, low power consumption, and cost-effectiveness. As the demand for advanced communication systems continues to increase, the EP2A15F672C9 is likely to remain a top choice for many applications. Furthermore, the chip model is designed to be easily upgradable, allowing users to upgrade their systems with the latest technologies as they become available.
In terms of future development, the EP2A15F672C9 is expected to remain a popular choice for advanced communication systems. As the demand for faster, more reliable, and secure communication systems continues to grow, the EP2A15F672C9 is likely to remain a top choice for many applications. Furthermore, the chip model is designed to be easily upgradable, allowing users to upgrade their systems with the latest technologies as they become available.
In terms of application environment, the EP2A15F672C9 is designed to support a wide range of technologies, including advanced security features, Quality of Service (QoS), and advanced power management. It is also capable of supporting a variety of network speeds, from 10 Mbps to 10 Gbps, and supports a wide range of features, such as Quality of Service (QoS), power management, and advanced security features.
Overall, the EP2A15F672C9 is a highly advanced and reliable chip model developed by the semiconductor giant Intel. It is designed to provide a high-level of performance and reliability for a wide range of applications. It is expected to remain popular in the future due to its high performance, low power consumption, and cost-effectiveness. Furthermore, the chip model is designed to be easily upgradable, allowing users to upgrade their systems with the latest technologies as they become available. It is also capable of supporting a variety of network speeds, from 10 Mbps to 10 Gbps, and supports a wide range of features, such as Quality of Service (QoS), power management, and advanced security features.
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5,297 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||