Intel Corporation
EP20K60ETC144-3
EP20K60ETC144-3 ECAD Model
EP20K60ETC144-3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 3.56 ns | |
| Number of Inputs | 84 | |
| Number of Outputs | 84 | |
| Number of Logic Cells | 2560 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 92 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 92 I/O | |
| Clock Frequency-Max | 160 MHz | |
| Output Function | MACROCELL | |
| Power Supplies | 1.8,1.8/3.3 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.87SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LFQFP, QFP144,.87SQ,20 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EP20K60ETC144-3 Datasheet Download
EP20K60ETC144-3 Overview
The chip model EP20K60ETC144-3 is a programmable logic device (PLD) produced by Altera Corporation. It is a member of the MAX family of devices, and it is designed to meet the needs of high-end applications. This model is designed to provide users with a high-speed, low-power solution for their programmable logic applications.
The original design intention of the chip model EP20K60ETC144-3 is to provide a high-performance and low-power solution for programmable logic applications. It is designed to provide a high-speed, low-power solution with a wide range of features and functions. The device is designed with high-speed, low-power logic cells that are optimized for high-speed, low-power applications. The device provides a wide range of features and functions, including high-speed logic cells, embedded memory blocks, and advanced I/O capabilities.
The EP20K60ETC144-3 chip model is capable of future upgrades and can be used in advanced communication systems. It is designed with a low-power logic cell that can be used for high-speed, low-power applications. The device also includes an embedded memory block that can be used for high-speed, low-power data storage. Additionally, the device includes advanced I/O capabilities that can be used for high-speed, low-power communication.
The product description and specific design requirements of the chip model EP20K60ETC144-3 should be carefully studied before using the device. It is important to understand the device's capabilities, features, and functions before using it in a project. Additionally, actual case studies and precautions should be taken when using the device in order to ensure that the device is used correctly and safely.
The chip model EP20K60ETC144-3 can be applied to the development and popularization of future intelligent robots. The device is designed with a high-speed, low-power logic cell that can be used for high-speed, low-power applications. Additionally, the device includes an embedded memory block that can be used for high-speed, low-power data storage. The device also includes advanced I/O capabilities that can be used for high-speed, low-power communication. In order to use the device effectively in the development and popularization of future intelligent robots, technical talents such as software engineers, embedded system designers, and roboticists are needed.
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