
Intel Corporation
EP20K60EQC208-2N
EP20K60EQC208-2N ECAD Model
EP20K60EQC208-2N Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Propagation Delay | 2.41 ns | |
Number of Inputs | 140 | |
Number of Outputs | 140 | |
Number of Logic Cells | 2560 | |
Number of Dedicated Inputs | 4 | |
Number of I/O Lines | 148 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 4 DEDICATED INPUTS, 148 I/O | |
Clock Frequency-Max | 160 MHz | |
Output Function | MACROCELL | |
Power Supplies | 1.8,1.8/3.3 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PQFP-G208 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Number of Terminals | 208 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FQFP | |
Package Equivalence Code | QFP208,1.2SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 28 mm | |
Length | 28 mm | |
Seated Height-Max | 4.1 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FQFP, QFP208,1.2SQ,20 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
EP20K60EQC208-2N Datasheet Download
EP20K60EQC208-2N Overview
The chip model EP20K60EQC208-2N is a high-performance, low-power FPGA designed for a variety of digital signal processing applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other complex applications. This chip model is designed to be used in combination with HDL (Hardware Description Language) to facilitate the creation of custom designs.
The original design intention of the chip model EP20K60EQC208-2N was to provide a powerful, low-cost FPGA solution that could be used in a variety of applications. The chip has been designed with the latest technology, allowing for high-speed operation and low power consumption. It is also capable of being upgraded in the future to provide more features.
The product description of the chip model EP20K60EQC208-2N includes a variety of features such as high-speed operation, low power consumption, and a wide range of I/O ports. It has a maximum operating frequency of 200MHz and can support up to 160 user-defined logic elements. This chip model also has a wide range of memory options, including SRAM, Flash, and FIFO. It is also designed to be compatible with a variety of HDL languages, including Verilog and VHDL.
In terms of application, the chip model EP20K60EQC208-2N is suitable for a wide range of digital signal processing applications, including image processing, video processing, and embedded processing. It is also suitable for advanced communication systems, such as cellular networks and wireless networks. In addition, this chip model can be used in a variety of industrial automation applications.
When designing with the chip model EP20K60EQC208-2N, it is important to consider the specific design requirements of the application. This includes the type of I/O ports required, the number of logic elements needed, and the type of memory needed. It is also important to consider the power consumption of the chip model, as this will affect the overall performance of the system.
In addition, there are a number of case studies that can be used as examples when designing with the chip model EP20K60EQC208-2N. These case studies provide an insight into the various design considerations and challenges that can be encountered when designing with this chip model. It is also important to consider any potential risks associated with the chip model, such as the potential for data loss or corruption.
In summary, the chip model EP20K60EQC208-2N is a powerful, low-cost FPGA solution that is suitable for a variety of digital signal processing applications. It is designed to be used in combination with HDL to facilitate the creation of custom designs. It is important to consider the specific design requirements of the application, as well as any potential risks associated with the chip model, when designing with this chip model.
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