Intel Corporation
EP20K600EFC672-1XN
EP20K600EFC672-1XN ECAD Model
EP20K600EFC672-1XN Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 1.57 ns | |
| Number of Inputs | 500 | |
| Number of Outputs | 500 | |
| Number of Logic Cells | 24320 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 508 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 508 I/O | |
| Clock Frequency-Max | 160 MHz | |
| Output Function | MACROCELL | |
| Power Supplies | 1.8,1.8/3.3 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | FINE LINE, BGA-672 | |
| Pin Count | 672 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Intel |
EP20K600EFC672-1XN Overview
The chip model EP20K600EFC672-1XN is a highly advanced and powerful integrated circuit that has been designed to meet the needs of the most demanding applications. It is a part of the Altera family of FPGAs, which are designed for high speed and low power consumption. This chip model is suitable for a wide range of applications, from consumer electronics to industrial automation.
The EP20K600EFC672-1XN chip model has several key advantages, including its high performance, low power consumption, and scalability. It is able to support multiple data rates and protocols, making it suitable for use in a variety of applications. The chip also has a wide range of peripheral interfaces, including Ethernet, USB, and PCI Express, making it suitable for use in a wide range of systems.
The EP20K600EFC672-1XN chip model is expected to be in high demand in the future, due to its versatility and scalability. It is likely to be used in a variety of applications, including consumer electronics, industrial automation, and communication systems. The chip model is also likely to be used in the development and popularization of future intelligent robots, as it is capable of supporting a wide range of data rates and protocols.
The original design intention of the EP20K600EFC672-1XN chip model was to provide a high-performance, low-power, and scalable solution for a variety of applications. The chip model is capable of supporting multiple data rates and protocols, making it suitable for use in a variety of systems. It is also possible to upgrade the chip model in the future, as new technologies become available.
In order to use the EP20K600EFC672-1XN chip model effectively, a variety of technical skills are necessary. This includes knowledge of FPGA design, embedded systems, and communication protocols. Additionally, knowledge of programming languages such as Verilog and VHDL is necessary in order to make use of the chip model’s capabilities.
The EP20K600EFC672-1XN chip model is a powerful and versatile integrated circuit that has been designed to meet the needs of the most demanding applications. It has several key advantages, including its high performance, low power consumption, and scalability. It is expected to be in high demand in the future, due to its versatility and scalability. In order to use the chip model effectively, a variety of technical skills are necessary, including knowledge of FPGA design, embedded systems, and communication protocols. It is also possible to upgrade the chip model in the future, as new technologies become available.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||