Intel Corporation
EP20K600EFC33-2
EP20K600EFC33-2 ECAD Model
EP20K600EFC33-2 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 2.25 ns | |
| Number of Inputs | 580 | |
| Number of Outputs | 580 | |
| Number of Logic Cells | 24320 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 588 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 588 I/O | |
| Output Function | MACROCELL | |
| Power Supplies | 1.8,1.8/3.3 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B1020 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 1020 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1020,32X32,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 33 mm | |
| Length | 33 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1020,32X32,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
EP20K600EFC33-2 Datasheet Download
EP20K600EFC33-2 Overview
The chip model EP20K600EFC33-2 is a highly advanced chip model with a variety of features and capabilities. It is designed to provide a complete solution for the communication, storage, and processing needs of a wide range of applications. The model is based on the latest technologies and is capable of providing the highest levels of performance, reliability, and scalability.
The EP20K600EFC33-2 chip model is designed to be used in a variety of industries, including aerospace, automotive, industrial, and consumer electronics. The model is capable of supporting a variety of communication protocols, including Ethernet, Wi-Fi, Bluetooth, and more. Additionally, it is designed to be compatible with a wide range of operating systems and hardware platforms.
The EP20K600EFC33-2 chip model is designed to provide high levels of performance and scalability. It is capable of supporting multiple cores, allowing for increased processing power and improved multitasking capabilities. Additionally, it is designed to be highly efficient, reducing power consumption and providing longer battery life.
The original design intention of the chip model EP20K600EFC33-2 was to provide a reliable and efficient solution for a variety of applications. It is designed to be highly compatible with a wide range of operating systems and hardware platforms. Additionally, it is capable of supporting the latest technologies, such as 5G, Wi-Fi 6, and more. As the demand for advanced communication systems continues to grow, the EP20K600EFC33-2 chip model is expected to remain a popular choice for many applications.
In terms of industry trends, the EP20K600EFC33-2 chip model is expected to remain in high demand in the future. As the demand for advanced communication systems continues to grow, the model is expected to remain a popular choice for many applications. Additionally, the model is expected to remain compatible with a wide range of operating systems and hardware platforms.
The EP20K600EFC33-2 chip model is also expected to remain upgradeable in the future. As the demand for advanced communication systems continues to grow, the model is expected to be capable of supporting new technologies. Additionally, the model is expected to remain highly efficient, reducing power consumption and providing longer battery life.
In conclusion, the EP20K600EFC33-2 chip model is a highly advanced chip model with a variety of features and capabilities. It is designed to provide a complete solution for the communication, storage, and processing needs of a wide range of applications. The model is expected to remain in high demand in the future, as the demand for advanced communication systems continues to grow. It is also expected to remain upgradeable and capable of supporting new technologies. Additionally, the model is designed to be highly efficient, reducing power consumption and providing longer battery life.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||