Intel Corporation
EP20K400CB652C7
EP20K400CB652C7 ECAD Model
EP20K400CB652C7 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 1.48 ns | |
| Number of Inputs | 480 | |
| Number of Outputs | 480 | |
| Number of Logic Cells | 16640 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 488 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 488 I/O | |
| Output Function | MACROCELL | |
| Power Supplies | 1.8,1.8/3.3 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B652 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 652 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA652,35X35,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | 45 X 45 MM, 1.27 MM PITCH, BGA-652 | |
| Pin Count | 652 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
EP20K400CB652C7 Overview
The EP20K400CB652C7 chip model is a high-performance device that is suitable for a range of applications, including digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which is a hardware description language used to program digital logic circuits. This chip model is capable of handling complex operations and can be used in a variety of scenarios.
The EP20K400CB652C7 chip model is ideal for use in networks and can be used for a variety of intelligent scenarios. It is capable of processing large amounts of data quickly and accurately, making it suitable for use in the era of fully intelligent systems. The chip model is capable of recognizing patterns and making decisions based on the data it receives. This makes it a powerful tool for a range of applications, from autonomous vehicles to smart home systems.
The EP20K400CB652C7 chip model is designed to meet specific design requirements. It is designed to be robust and reliable, with a range of features that make it suitable for a range of applications. These features include a wide range of I/O operations, a powerful instruction set, and a high-speed clock. It is also designed to be low power and efficient, making it suitable for use in a range of scenarios.
Case studies can be used to demonstrate the effectiveness of the EP20K400CB652C7 chip model in a range of applications. For example, it can be used to control a robotic arm in an automated factory, or it can be used to process images in real-time for facial recognition. In each case, the chip model can be used to provide accurate and reliable results.
When using the EP20K400CB652C7 chip model, there are a few precautions that should be taken. It is important to ensure that the chip model is properly programmed and configured for the specific application it is being used for. This will ensure that the chip model is able to process data correctly and reliably. Additionally, it is important to ensure that the chip model is properly cooled and that it is not exposed to extreme temperatures or other environmental factors that could damage it.
The EP20K400CB652C7 chip model is a powerful device that is suitable for a range of applications, including digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language and is capable of handling complex operations. It is ideal for use in networks and can be used for a variety of intelligent scenarios. It is designed to meet specific design requirements and can be used in a range of case studies. When using the chip model, there are a few precautions that should be taken to ensure that it is properly programmed and configured for the specific application it is being used for.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||