EP20K200FC484-3V
EP20K200FC484-3V
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Intel Corporation

EP20K200FC484-3V


EP20K200FC484-3V
F18-EP20K200FC484-3V
Active
IC FPGA 382 I/O 484FBGA
484-FBGA (23x23)

EP20K200FC484-3V ECAD Model


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EP20K200FC484-3V Attributes


Type Description Select
Mfr Intel
Series APEX-20K®
Package Tray
Number of LABs/CLBs 832
Number of Logic Elements/Cells 8320
Total RAM Bits 106496
Number of I/O 382
Number of Gates 526000
Voltage - Supply 2.375V ~ 2.625V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 484-BBGA
Supplier Device Package 484-FBGA (23x23)
Base Product Number EP20K200

EP20K200FC484-3V Datasheet Download


EP20K200FC484-3V Overview



The EP20K200FC484-3V is a Field Programmable Gate Array (FPGA) chip made by Altera Corporation. It is a member of the Stratix II family of FPGAs and is based on the company’s patented HyperFlex architecture. This chip is designed for use in high-performance applications such as image processing, communications, and signal processing.


The EP20K200FC484-3V features a total of 20,000 logic elements and 200Kbits of embedded memory. It has a total of 576 I/O pins and is capable of speeds up to 400 MHz. It also features a wide range of integrated features such as phase-locked loops, clock management, and high-speed transceivers. The chip has a power dissipation of 6.7 W at a maximum ambient temperature of 85°C.


This FPGA is ideal for applications that require high performance, low power consumption, and a high level of flexibility. It is suitable for use in high-speed signal processing, communications, imaging, and video applications. It is also suitable for use in automotive, medical, industrial, and aerospace applications.


The EP20K200FC484-3V is available in a variety of packages, including a 7-mm x 7-mm BGA package, a 10-mm x 10-mm BGA package, and a 15-mm x 15-mm BGA package. It is also available in a variety of operating temperatures, from -40°C to +85°C.


Overall, the EP20K200FC484-3V is a powerful and versatile FPGA chip that is suitable for a wide range of high-performance applications. It offers high performance, low power consumption, and a high level of flexibility. It is available in a variety of packages and operating temperatures, making it suitable for a wide range of applications.



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