
Intel Corporation
EP20K200FC484-1XN
EP20K200FC484-1XN ECAD Model
EP20K200FC484-1XN Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Propagation Delay | 2.5 ns | |
Number of Inputs | 376 | |
Number of Outputs | 376 | |
Number of Logic Cells | 8320 | |
Number of Dedicated Inputs | 4 | |
Number of I/O Lines | 382 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 4 DEDICATED INPUTS, 382 I/O | |
Output Function | MACROCELL | |
Power Supplies | 2.5,2.5/3.3 V | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B484 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Number of Terminals | 484 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA484,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 2.1 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA484,22X22,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
EP20K200FC484-1XN Datasheet Download
EP20K200FC484-1XN Overview
The EP20K200FC484-1XN chip model is a high-performance digital signal processor, embedded processor, and image processor. It is designed for use with HDL (Hardware Description Language) and is a powerful tool for digital signal processing and embedded processing. This chip model is widely used in various industries and has several advantages that make it a popular choice.
The EP20K200FC484-1XN chip model offers a high-performance architecture with low power consumption, making it an efficient and cost-effective solution for many industries. It features a large array of on-chip resources, including memory, logic, and communication interfaces. This makes it well-suited for a variety of applications, including digital signal processing, embedded processing, and image processing. Additionally, the chip model is compatible with a range of operating systems, making it an ideal choice for many applications.
The EP20K200FC484-1XN chip model is expected to be in high demand in the future due to its versatility and performance. It can be used in a variety of industries, including automotive, aerospace, medical, and industrial automation. Additionally, it can be used in networks and intelligent scenarios to enable faster, more efficient operations. It is also expected to be used in the era of fully intelligent systems, as it is capable of handling a wide range of tasks, including image processing, machine learning, and data analysis.
In conclusion, the EP20K200FC484-1XN chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It is expected to be in high demand in the future due to its versatility and performance. It can be used in a variety of industries and can be used in networks and intelligent scenarios to enable faster, more efficient operations. Additionally, it is expected to be used in the era of fully intelligent systems, as it is capable of handling a wide range of tasks.
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