EP20K200EFC672-3
EP20K200EFC672-3
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rohs

Intel Corporation

EP20K200EFC672-3


EP20K200EFC672-3
F18-EP20K200EFC672-3
Active
LOADABLE PLD, 2.33 ns, CMOS, BGA, BGA672,26X26,40
BGA, BGA672,26X26,40

EP20K200EFC672-3 ECAD Model


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EP20K200EFC672-3 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Propagation Delay 2.33 ns
Number of Inputs 368
Number of Outputs 368
Number of Logic Cells 8320
Number of Dedicated Inputs 4
Number of I/O Lines 376
Programmable Logic Type LOADABLE PLD
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 4 DEDICATED INPUTS, 376 I/O
Clock Frequency-Max 160 MHz
Output Function MACROCELL
Power Supplies 1.8,1.8/3.3 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B672
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Number of Terminals 672
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA672,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA672,26X26,40
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

EP20K200EFC672-3 Datasheet Download


EP20K200EFC672-3 Overview



The chip model EP20K200EFC672-3 is a powerful FPGA created by Altera Corporation. It is designed to provide a reliable, high-speed and low-power solution for various applications. The chip model EP20K200EFC672-3 is suitable for a variety of applications, including advanced communication systems.


This chip model is designed to be highly reliable and efficient. It is designed with an advanced architecture that allows it to support high-speed operations and provide low power consumption. This chip model also features a wide range of features, including high-speed memory, low-power logic blocks, integrated DSP blocks, and a range of I/O options.


The chip model EP20K200EFC672-3 is a powerful FPGA that can be used in a variety of applications. It can be used in advanced communication systems, such as 5G networks and beyond. It can also be used in intelligent systems, such as autonomous vehicles, robotics, and artificial intelligence.


In addition, the chip model EP20K200EFC672-3 can be used in a variety of other applications. It can be used for data processing, data storage, and for developing embedded systems. It can also be used for designing custom logic circuits and for developing complex systems.


The chip model EP20K200EFC672-3 is designed with a range of features to meet the needs of different applications. It is designed to be highly reliable, efficient, and feature-rich. It is also designed to be upgradable, allowing users to upgrade the chip model to meet their future needs.


When using the chip model EP20K200EFC672-3, it is important to follow the specific design requirements. It is important to understand the chip model’s features and capabilities, as well as the specific design requirements. It is also important to understand the chip model’s limitations, such as its power consumption and its maximum operating temperature.


The chip model EP20K200EFC672-3 has been used in a variety of applications, including advanced communication systems and intelligent systems. It is a powerful FPGA that can be used in a variety of different applications. It is designed to be reliable, efficient, and feature-rich, and can be upgraded to meet future needs. When using the chip model EP20K200EFC672-3, it is important to understand the specific design requirements and the chip model’s limitations.



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Unit Price: $234.00
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Pricing (USD)

QTY Unit Price Ext Price
1+ $217.6200 $217.6200
10+ $215.2800 $2,152.8000
100+ $203.5800 $20,358.0000
1000+ $191.8800 $95,940.0000
10000+ $175.5000 $175,500.0000
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