EP20K200EFC484-3N
EP20K200EFC484-3N
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Intel Corporation

EP20K200EFC484-3N


EP20K200EFC484-3N
F18-EP20K200EFC484-3N
Active
IC FPGA 376 I/O 484FBGA
484-FBGA (23x23)

EP20K200EFC484-3N ECAD Model


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EP20K200EFC484-3N Attributes


Type Description Select
Mfr Intel
Series APEX-20KE®
Package Tray
Number of LABs/CLBs 832
Number of Logic Elements/Cells 8320
Total RAM Bits 106496
Number of I/O 376
Number of Gates 526000
Voltage - Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 484-BBGA
Supplier Device Package 484-FBGA (23x23)
Base Product Number EP20K200

EP20K200EFC484-3N Datasheet Download


EP20K200EFC484-3N Overview



The EP20K200EFC484-3N is a high-performance, low-power field programmable gate array (FPGA) designed by Altera Corporation. It is a member of Altera's Stratix II family of FPGAs, and is manufactured using a 0.13-micron process.


The EP20K200EFC484-3N features 20,000 logic elements, up to 8 megabits of embedded memory, and up to 8 megabits of distributed RAM. It also includes up to 8 multipliers and up to 8 DSP blocks. The device is capable of operating at speeds up to 200 MHz and contains up to 1,024 I/O pins. It is designed to support a wide variety of applications, including high-speed networking, video processing, and data storage.


The EP20K200EFC484-3N is a highly configurable device, and can be easily integrated into a wide range of systems. It is designed to be compatible with a variety of development tools, including Altera's Quartus II design software. The device also includes a wide range of features, such as high-speed transceivers, error correction coding, and redundancy.


The EP20K200EFC484-3N is an ideal choice for a variety of applications, such as wireless communication systems, medical imaging systems, and industrial automation systems. It is also suitable for use in high-performance computing systems, such as servers and workstations. The device is designed to be highly reliable, and is capable of operating in extreme temperatures and harsh environments.



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