Intel Corporation
EP20K200EBC356-1N
EP20K200EBC356-1N ECAD Model
EP20K200EBC356-1N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 1.58 ns | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 271 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 271 I/O | |
| Output Function | MACROCELL | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B356 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 356 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.63 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
EP20K200EBC356-1N Datasheet Download
EP20K200EBC356-1N Overview
The EP20K200EBC356-1N chip model is a state-of-the-art integrated circuit developed by a leading semiconductor manufacturer. It is designed to support a wide range of applications, including high-speed communication, networking, and multimedia. It is also used in a variety of intelligent systems.
The EP20K200EBC356-1N chip model is a highly integrated device that combines a variety of components into a single package. It has a wide range of features, including high-speed signal processing, low-power consumption, and a powerful computing architecture. The chip is also designed to be highly reliable and robust, making it ideal for use in mission-critical applications.
The EP20K200EBC356-1N chip model is designed to be scalable and upgradeable. This means that the chip can be easily adapted to meet the needs of new applications and technologies. The chip is also designed to be compatible with a wide range of communication protocols, making it suitable for use in a variety of networks and intelligent systems.
In terms of industry trends, the EP20K200EBC356-1N chip model is likely to remain popular in the near future. It is already being used in a variety of applications, including high-speed communication, networking, and multimedia. In addition, the chip is expected to be used in a variety of intelligent systems in the future, including autonomous vehicles and smart homes.
In terms of future applications, the EP20K200EBC356-1N chip model is expected to be used in a variety of intelligent scenarios. It is likely to be used in the development of fully autonomous systems, as well as in the deployment of intelligent networks. The chip is also likely to be used in the development of advanced communication systems, such as 5G networks.
Overall, the EP20K200EBC356-1N chip model is a highly advanced integrated circuit that is designed to meet the needs of a variety of applications. It is designed to be scalable and upgradeable, making it suitable for use in a variety of networks and intelligent systems. It is also expected to remain popular in the near future, as it is already being used in a variety of applications.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||