Intel Corporation
EP20K200BC356-2
EP20K200BC356-2 ECAD Model
EP20K200BC356-2 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 3 ns | |
| Number of Inputs | 271 | |
| Number of Outputs | 271 | |
| Number of Logic Cells | 8320 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 277 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 277 I/O | |
| Output Function | MACROCELL | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B356 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 356 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA356,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.63 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | LBGA, BGA356,26X26,50 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
EP20K200BC356-2 Datasheet Download
EP20K200BC356-2 Overview
The chip model EP20K200BC356-2 is a high-performance digital signal processor with a wide range of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other tasks. It requires the use of HDL language for development, which is a high-level language used to design and simulate digital and computer systems.
The EP20K200BC356-2 chip model could be used in the future for networks and intelligent scenarios. It has the potential to be used in the era of fully intelligent systems and could be applied to the development and popularization of future intelligent robots. In order for the chip model to be used effectively, it requires technical talents with a good understanding of HDL language and the ability to design and simulate digital and computer systems.
The EP20K200BC356-2 chip model has a wide range of applications and could be used in many different scenarios. It is a powerful tool for digital signal processing, embedded processing, and image processing. Its use in the future for networks and intelligent scenarios could be invaluable, and it could be used to develop and popularize future intelligent robots. In order to make the most of the chip model, technical talents with a good understanding of HDL language and the ability to design and simulate digital and computer systems are essential.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||