Intel Corporation
EP20K160EFC484-3N
EP20K160EFC484-3N ECAD Model
EP20K160EFC484-3N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 2.29 ns | |
| Number of Inputs | 308 | |
| Number of Outputs | 308 | |
| Number of Logic Cells | 6400 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 316 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 316 I/O | |
| Clock Frequency-Max | 160 MHz | |
| Output Function | MACROCELL | |
| Power Supplies | 1.8,1.8/3.3 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.1 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA484,22X22,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
EP20K160EFC484-3N Datasheet Download
EP20K160EFC484-3N Overview
The chip model EP20K160EFC484-3N is a high-performance, low-power FPGA device from Altera Corporation. It is designed to meet the needs of a wide range of applications, from high-speed data processing to embedded control. Its features include a large number of configurable logic blocks, high-speed I/O, and a wide range of memory and communications options.
The EP20K160EFC484-3N is designed to provide high-speed, low-power performance in a wide range of applications. It is suitable for use in a variety of communication, storage, and control systems. It offers a wide range of features, including high-speed I/O, configurable logic blocks, and a large number of memory and communications options.
The EP20K160EFC484-3N is designed to meet the needs of a wide range of applications, from high-speed data processing to embedded control. Its features include a large number of configurable logic blocks, high-speed I/O, and a wide range of memory and communications options. It is suitable for use in a variety of communication, storage, and control systems.
The EP20K160EFC484-3N is designed to be used in a wide range of applications, including high-speed data processing, embedded control, and communications. Its features include a large number of configurable logic blocks, high-speed I/O, and a wide range of memory and communications options. It is suitable for use in a variety of communication, storage, and control systems.
In terms of industry trends, the EP20K160EFC484-3N is designed to meet the needs of a wide range of applications. It is suitable for use in a variety of communication, storage, and control systems. As such, the chip model is likely to be used in the future for a variety of applications, including high-speed data processing, embedded control, and communications.
Regarding the future development of related industries, the EP20K160EFC484-3N is designed to meet the needs of a wide range of applications. It is suitable for use in a variety of communication, storage, and control systems. As such, it is likely that the chip model will be used in the future for a variety of applications, including high-speed data processing, embedded control, and communications.
Whether the application environment requires the support of new technologies depends on what specific technologies are needed. The EP20K160EFC484-3N is designed to meet the needs of a wide range of applications, and its features include a large number of configurable logic blocks, high-speed I/O, and a wide range of memory and communications options. As such, it is likely that the chip model will be able to support a variety of new technologies, depending on the specific requirements of the application.
Regarding the original design intention of the chip model EP20K160EFC484-3N and the possibility of future upgrades, the chip model is designed to meet the needs of a wide range of applications. Its features include a large number of configurable logic blocks, high-speed I/O, and a wide range of memory and communications options. As such, it is likely that the chip model can be upgraded in the future to meet the needs of new applications.
In terms of product description and specific design requirements, the EP20K160EFC484-3N is designed to meet the needs of a wide range of applications. It is suitable for use in a variety of communication, storage, and control systems. Its features include a large number of configurable logic blocks, high-speed I/O, and a wide range of memory and communications options. The specific design requirements of the chip model will depend on the application requirements.
In terms of actual case studies and precautions, the EP20K160EFC484-3N is designed to meet the needs of a wide range of applications. It is suitable for use in a variety of communication, storage, and control systems. Its features include a large number of configurable logic blocks, high-speed I/O, and a wide range of memory and communications options. There are a number of case studies and precautions that should be taken into consideration when using the chip model, such as power consumption, signal integrity, and timing requirements.
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