Intel Corporation
EP20K1500EFC33-3
EP20K1500EFC33-3 ECAD Model
EP20K1500EFC33-3 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 2.32 ns | |
| Number of Inputs | 800 | |
| Number of Outputs | 800 | |
| Number of Logic Cells | 51840 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 808 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 808 I/O | |
| Output Function | MACROCELL | |
| Power Supplies | 1.8,1.8/3.3 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B1020 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 5A | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Number of Terminals | 1020 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1020,32X32,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 33 mm | |
| Length | 33 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | BGA | |
| Package Description | FINE LINE, BGA-1020 | |
| Pin Count | 1020 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
EP20K1500EFC33-3 Overview
The chip model EP20K1500EFC33-3 is a cutting-edge technology that has been developed to meet the growing demand for high-performance semiconductor chips. It is a powerful and versatile chip that has been designed to provide a wide range of functions and capabilities. The chip model EP20K1500EFC33-3 can be used in a variety of industries, ranging from consumer electronics to telecommunications and networking.
The chip model EP20K1500EFC33-3 has been designed with the latest industry trends in mind, and is capable of handling a wide range of tasks. It is capable of supporting a variety of technologies, including high-speed communication protocols, advanced signal processing, and artificial intelligence. The chip model EP20K1500EFC33-3 is also capable of providing support for new technologies as they become available, allowing it to adapt to changing application environments.
In terms of its future development, the chip model EP20K1500EFC33-3 is capable of being upgraded to meet the needs of more advanced applications. It is also capable of being applied to networks and intelligent scenarios, allowing it to be used in the era of fully intelligent systems. Furthermore, the chip model EP20K1500EFC33-3 is capable of being used in advanced communication systems, such as 5G networks.
Overall, the chip model EP20K1500EFC33-3 is a powerful and versatile chip that is capable of providing a wide range of functions and capabilities. It is capable of supporting a variety of technologies, and is capable of being upgraded to meet the needs of more advanced applications. Furthermore, it is capable of being used in networks and intelligent scenarios, allowing it to be used in the era of fully intelligent systems. As such, it is clear that the chip model EP20K1500EFC33-3 is an important piece of technology that is capable of providing a wide range of benefits to a variety of industries.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||