EP20K100EFC196-3
EP20K100EFC196-3
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rohs

Intel Corporation

EP20K100EFC196-3


EP20K100EFC196-3
F18-EP20K100EFC196-3
Active
LOADABLE PLD, BGA
BGA

EP20K100EFC196-3 ECAD Model


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EP20K100EFC196-3 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Dedicated Inputs 4
Number of I/O Lines 143
Programmable Logic Type LOADABLE PLD
Temperature Grade OTHER
Package Shape SQUARE
Organization 4 DEDICATED INPUTS, 143 I/O
Output Function MACROCELL
JESD-30 Code S-PBGA-B196
Qualification Status Not Qualified
JESD-609 Code e0
Operating Temperature-Max 85 °C
Number of Terminals 196
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Position BOTTOM
Ihs Manufacturer INTEL CORP
Package Description BGA,
Reach Compliance Code compliant
HTS Code 8542.39.00.01

EP20K100EFC196-3 Datasheet Download


EP20K100EFC196-3 Overview



The chip model EP20K100EFC196-3 is a cutting-edge development in the semiconductor industry. It is a high-performance, low-power FPGA chip, designed to meet the needs of a variety of applications. It offers a range of features that make it suitable for a variety of applications, such as networking, communications, and digital signal processing.


The EP20K100EFC196-3 chip model has a number of advantages. It is a low-cost, low-power FPGA chip that is highly efficient and reliable. It offers a wide range of features, including high-speed signal processing, high-speed communication, and low-power consumption. In addition, it has a high level of integration, allowing for the design of complex systems and functions.


The chip model EP20K100EFC196-3 is expected to be in high demand in the future. Its low-cost and high-performance features make it ideal for a variety of applications, such as the development of advanced communication systems, the development of intelligent robots, and the development of other cutting-edge technologies. As these technologies become more popular, demand for the chip model EP20K100EFC196-3 is expected to increase.


The original design intention of the chip model EP20K100EFC196-3 was to provide a low-cost, low-power FPGA chip that could be used in a variety of applications. It was designed to be highly efficient and reliable, and to provide a wide range of features. The chip model was designed with the future in mind, and is capable of being upgraded in the future. This makes it suitable for a variety of applications, including the development of advanced communication systems and the development of intelligent robots.


The chip model EP20K100EFC196-3 can be used in the development and popularization of future intelligent robots. The chip model has a high level of integration, making it suitable for the development of complex systems and functions. In addition, it is capable of providing the necessary power and processing speed required for the development of intelligent robots. To use the chip model effectively, technical talents are needed who are familiar with the features and capabilities of the chip model.


In conclusion, the chip model EP20K100EFC196-3 is a cutting-edge development in the semiconductor industry. It offers a range of features that make it suitable for a variety of applications, such as networking, communications, and digital signal processing. It is expected to be in high demand in the future and is capable of being upgraded in the future. The chip model can be used in the development and popularization of future intelligent robots, and technical talents are needed to use the model effectively.



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