
Intel Corporation
EP20K100BC356-3V
EP20K100BC356-3V ECAD Model
EP20K100BC356-3V Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Propagation Delay | 500 ps | |
Number of Inputs | 246 | |
Number of Outputs | 246 | |
Number of Logic Cells | 4160 | |
Number of Dedicated Inputs | 4 | |
Number of I/O Lines | 252 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 4 DEDICATED INPUTS, 252 I/O | |
Output Function | MACROCELL | |
Power Supplies | 2.5,2.5/3.3 V | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B356 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Operating Temperature-Max | 85 °C | |
Number of Terminals | 356 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA356,26X26,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 1.63 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | LBGA, BGA356,26X26,50 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991.D |
EP20K100BC356-3V Datasheet Download
EP20K100BC356-3V Overview
The chip model EP20K100BC356-3V is a new type of chip model developed by a leading semiconductor company. It is a low-power, high-performance chip model that is designed to meet the needs of various industries and applications. Its main features include a low power consumption, high performance, and a wide range of application scenarios.
The EP20K100BC356-3V chip model has several advantages. It has a low power consumption, which makes it suitable for applications that require energy efficiency. It also has a high performance, which makes it suitable for applications that require a high degree of accuracy and reliability. Furthermore, its wide range of application scenarios makes it suitable for a variety of industries and applications.
The expected demand for the EP20K100BC356-3V chip model in related industries is likely to increase in the future. This is because the chip model is designed to meet the needs of various industries and applications. As the demand for energy efficiency and accuracy increases, the EP20K100BC356-3V chip model is likely to become increasingly popular.
The original design intention of the EP20K100BC356-3V chip model was to provide a low-power, high-performance chip model that could be used in a wide range of applications. It is possible that the chip model will be upgraded in the future to meet the demands of advanced communication systems. The chip model could be improved to provide better performance, energy efficiency, and reliability.
The EP20K100BC356-3V chip model could be used in networks and intelligent scenarios in the future. It could be used in networks to provide better performance, energy efficiency, and reliability. It could also be used in intelligent scenarios to provide better accuracy and reliability. In addition, it could be used in the era of fully intelligent systems to provide better performance and accuracy.
Overall, the EP20K100BC356-3V chip model is a low-power, high-performance chip model that is designed to meet the needs of various industries and applications. It has several advantages, including a low power consumption, high performance, and a wide range of application scenarios. The expected demand for the chip model in related industries is likely to increase in the future, and it is possible that the chip model will be upgraded to meet the demands of advanced communication systems. The chip model could be used in networks and intelligent scenarios in the future, and it could be used in the era of fully intelligent systems to provide better performance and accuracy.
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