EP20K100BC356-3V
EP20K100BC356-3V
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rohs

Intel Corporation

EP20K100BC356-3V


EP20K100BC356-3V
F18-EP20K100BC356-3V
Active
LOADABLE PLD, 500 ps, CMOS, LBGA, BGA356,26X26,50
LBGA, BGA356,26X26,50

EP20K100BC356-3V ECAD Model


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EP20K100BC356-3V Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Propagation Delay 500 ps
Number of Inputs 246
Number of Outputs 246
Number of Logic Cells 4160
Number of Dedicated Inputs 4
Number of I/O Lines 252
Programmable Logic Type LOADABLE PLD
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 4 DEDICATED INPUTS, 252 I/O
Output Function MACROCELL
Power Supplies 2.5,2.5/3.3 V
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B356
Qualification Status Not Qualified
JESD-609 Code e1
Operating Temperature-Max 85 °C
Number of Terminals 356
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA356,26X26,50
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 1.63 mm
Ihs Manufacturer INTEL CORP
Package Description LBGA, BGA356,26X26,50
Reach Compliance Code compliant
HTS Code 8542.39.00.01
ECCN Code 3A991.D

EP20K100BC356-3V Datasheet Download


EP20K100BC356-3V Overview



The chip model EP20K100BC356-3V is a new type of chip model developed by a leading semiconductor company. It is a low-power, high-performance chip model that is designed to meet the needs of various industries and applications. Its main features include a low power consumption, high performance, and a wide range of application scenarios.


The EP20K100BC356-3V chip model has several advantages. It has a low power consumption, which makes it suitable for applications that require energy efficiency. It also has a high performance, which makes it suitable for applications that require a high degree of accuracy and reliability. Furthermore, its wide range of application scenarios makes it suitable for a variety of industries and applications.


The expected demand for the EP20K100BC356-3V chip model in related industries is likely to increase in the future. This is because the chip model is designed to meet the needs of various industries and applications. As the demand for energy efficiency and accuracy increases, the EP20K100BC356-3V chip model is likely to become increasingly popular.


The original design intention of the EP20K100BC356-3V chip model was to provide a low-power, high-performance chip model that could be used in a wide range of applications. It is possible that the chip model will be upgraded in the future to meet the demands of advanced communication systems. The chip model could be improved to provide better performance, energy efficiency, and reliability.


The EP20K100BC356-3V chip model could be used in networks and intelligent scenarios in the future. It could be used in networks to provide better performance, energy efficiency, and reliability. It could also be used in intelligent scenarios to provide better accuracy and reliability. In addition, it could be used in the era of fully intelligent systems to provide better performance and accuracy.


Overall, the EP20K100BC356-3V chip model is a low-power, high-performance chip model that is designed to meet the needs of various industries and applications. It has several advantages, including a low power consumption, high performance, and a wide range of application scenarios. The expected demand for the chip model in related industries is likely to increase in the future, and it is possible that the chip model will be upgraded to meet the demands of advanced communication systems. The chip model could be used in networks and intelligent scenarios in the future, and it could be used in the era of fully intelligent systems to provide better performance and accuracy.



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