EP20K1000CF672C7
EP20K1000CF672C7
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Intel Corporation

EP20K1000CF672C7


EP20K1000CF672C7
F18-EP20K1000CF672C7
Active
IC FPGA 508 I/O 672FBGA
672-FBGA (27x27)

EP20K1000CF672C7 ECAD Model


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EP20K1000CF672C7 Attributes


Type Description Select
Mfr Intel
Series APEX-20KC®
Package Tray
Number of LABs/CLBs 3840
Number of Logic Elements/Cells 38400
Total RAM Bits 327680
Number of I/O 508
Number of Gates 1772000
Voltage - Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 672-BBGA
Supplier Device Package 672-FBGA (27x27)
Base Product Number EP20K1000

EP20K1000CF672C7 Datasheet Download


EP20K1000CF672C7 Overview



The chip model EP20K1000CF672C7 is a groundbreaking development in the semiconductor industry, offering a wide range of features and capabilities for a variety of applications. Manufactured by Altera, this chip is a high-performance, low-power FPGA device that offers a range of features and benefits for a variety of applications.


The EP20K1000CF672C7 is a high-speed, low-power FPGA device that is capable of supporting a wide range of technologies. It has a configurable logic block that can be used to implement complex logic functions, and a high-speed transceiver that is capable of supporting a wide range of communication protocols. It also has a powerful memory controller that can be used to support a variety of memory devices.


In terms of industry trends, the EP20K1000CF672C7 is designed to be a versatile and reliable solution for a variety of applications. It is designed to be compatible with a wide range of communication protocols, such as Ethernet, USB, and Serial ATA. It is also designed to be compatible with a wide range of memory devices, such as DRAM, SRAM, and Flash. It is also designed to be compatible with a wide range of operating systems, such as Windows, Linux, and macOS.


In terms of future upgrades, the EP20K1000CF672C7 is capable of supporting new technologies as they become available. It is designed to be compatible with a wide range of communication protocols, such as Ethernet, USB, and Serial ATA, as well as a wide range of memory devices, such as DRAM, SRAM, and Flash. It is also designed to be compatible with a wide range of operating systems, such as Windows, Linux, and macOS.


When it comes to the product description and specific design requirements of the EP20K1000CF672C7, it is important to note that it is a versatile and reliable solution for a variety of applications. It is designed to be compatible with a wide range of communication protocols, such as Ethernet, USB, and Serial ATA, as well as a wide range of memory devices, such as DRAM, SRAM, and Flash. It is also designed to be compatible with a wide range of operating systems, such as Windows, Linux, and macOS.


In terms of actual case studies, the EP20K1000CF672C7 has been used in a variety of applications, such as medical imaging, automotive, industrial, and aerospace applications. It has been used in a variety of applications, such as medical imaging, automotive, industrial, and aerospace applications. In terms of precautions, it is important to note that the EP20K1000CF672C7 is a high-speed, low-power FPGA device and is not suitable for use in high-temperature or high-power applications.


In conclusion, the EP20K1000CF672C7 is a groundbreaking development in the semiconductor industry, offering a wide range of features and capabilities for a variety of applications. It is designed to be compatible with a wide range of communication protocols, such as Ethernet, USB, and Serial ATA, as well as a wide range of memory devices, such as DRAM, SRAM, and Flash. It is also designed to be compatible with a wide range of operating systems, such as Windows, Linux, and macOS. It is capable of supporting new technologies as they become available, and has been used in a variety of applications, such as medical imaging, automotive, industrial, and aerospace applications. However, it is important to note that the EP20K1000CF672C7 is a high-speed, low-power FPGA device and is not suitable for use in high-temperature or high-power applications.



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