
Intel Corporation
5SGXMA7K3F35C2LN
5SGXMA7K3F35C2LN ECAD Model
5SGXMA7K3F35C2LN Attributes
Type | Description | Select |
---|---|---|
Mfr | Intel | |
Series | Stratix® V GX | |
Package | Tray | |
Number of LABs/CLBs | 234720 | |
Number of Logic Elements/Cells | 622000 | |
Total RAM Bits | 51200000 | |
Number of I/O | 432 | |
Voltage - Supply | 0.82V ~ 0.88V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 1152-BBGA, FCBGA | |
Supplier Device Package | 1152-FBGA (35x35) | |
Base Product Number | 5SGXMA7 |
5SGXMA7K3F35C2LN Datasheet Download
5SGXMA7K3F35C2LN Overview
The chip model 5SGXMA7K3F35C2LN is a cutting-edge semiconductor device that has been designed with advanced features to meet the needs of a wide range of applications. This chip model is part of the Altera Stratix V family of FPGAs, which are designed to provide high-end performance, reliability, and scalability.
The 5SGXMA7K3F35C2LN chip model is designed to support a wide range of applications, including high-speed data processing, video processing, and storage. It offers significant advantages over traditional chip models, such as improved power efficiency and decreased design complexity. Moreover, its high-performance features make it suitable for applications that require high-speed data processing, such as high-frequency trading and real-time analytics.
The 5SGXMA7K3F35C2LN chip model also offers a variety of design advantages. It has a low power consumption, which makes it suitable for applications that require low power consumption. Additionally, its high-speed transceivers enable it to support high-speed data transfer. Moreover, its low-cost design makes it an attractive option for cost-sensitive applications.
In terms of future market trends, the 5SGXMA7K3F35C2LN chip model is expected to see increasing demand in the coming years. This is due to its high performance, low power consumption, and cost-effective design. Additionally, its scalability makes it suitable for a wide range of applications, including those that require high-speed data processing and storage.
When it comes to the product description and specific design requirements of the 5SGXMA7K3F35C2LN chip model, it is important to note that it has a number of features that must be taken into consideration when designing a system. These include the device's operating temperature range, the power consumption of the device, and the number of transceivers that the device can support. Additionally, the device's memory size and the type of memory that it supports must also be taken into consideration.
It is also important to note that when designing a system that utilizes the 5SGXMA7K3F35C2LN chip model, there are a number of precautions that must be taken. These include ensuring that the device is properly cooled, that the power supply is adequate, and that the system is properly shielded from EMI interference. Additionally, the system must be designed to ensure that it is compatible with the device's features and specifications.
In conclusion, the 5SGXMA7K3F35C2LN chip model is a high-performance, cost-effective, and power-efficient semiconductor device designed to meet the needs of a wide range of applications. It is expected to see increasing demand in the coming years due to its scalability and high-performance features. Furthermore, when designing a system that utilizes the device, it is important to take into consideration the device's product description and design requirements, as well as the necessary precautions that must be taken to ensure its proper operation.
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Pricing (USD)
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