5SGXMA7H3F35C3
5SGXMA7H3F35C3
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

5SGXMA7H3F35C3


5SGXMA7H3F35C3
F18-5SGXMA7H3F35C3
Active
IC FPGA 552 I/O 1152FBGA
1152-FBGA (35x35)

5SGXMA7H3F35C3 ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

5SGXMA7H3F35C3 Attributes


Type Description Select
Mfr Intel
Series Stratix® V GX
Package Tray
Number of LABs/CLBs 234720
Number of Logic Elements/Cells 622000
Total RAM Bits 51200000
Number of I/O 552
Voltage - Supply 0.82V ~ 0.88V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FBGA (35x35)
Base Product Number 5SGXMA7

5SGXMA7H3F35C3 Datasheet Download


5SGXMA7H3F35C3 Overview



The 5SGXMA7H3F35C3 is an Altera Field Programmable Gate Array (FPGA) chip model. It is a member of the Stratix V family of FPGAs, and is based on the 28nm Embedded TriMatrix technology. It features a high-performance, low-power architecture, with a maximum of 1.5 million logic elements, up to 6.4 million adaptive logic modules, and up to 1.7 million memory bits. The chip is optimized for high-speed interfaces, and includes high-speed transceivers, as well as a high-performance DSP block.


The 5SGXMA7H3F35C3 chip is ideal for applications requiring high-speed, low-power performance, such as high-performance computing, video processing, and embedded systems. It is capable of operating at up to 800MHz, and is designed to support multiple interface standards, including PCIe, USB, Ethernet, and Serial RapidIO. It also supports a wide range of I/O solutions, including LVDS, MIPI, and HCSL.


The 5SGXMA7H3F35C3 chip offers several features that make it suitable for a wide range of applications. It includes a large number of configurable I/O pins, as well as a wide range of configurable logic blocks. It also supports a wide range of memory technologies, including DDR3, QDRII+, and RLDRAM. It is designed to be highly reliable, and is capable of operating in temperatures ranging from -40°C to +85°C.


In summary, the 5SGXMA7H3F35C3 is a high-performance, low-power FPGA chip model that is ideal for a wide range of applications. It features a high-speed transceiver, a high-performance DSP block, and a wide range of configurable logic and memory blocks. It is designed to operate reliably in a wide range of temperatures, and is capable of operating at up to 800MHz.



4,371 In Stock


I want to buy

Unit Price: N/A
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
No reference price found.

Quick Quote