
Intel Corporation
5SGXMA5K2F40I2N
5SGXMA5K2F40I2N ECAD Model
5SGXMA5K2F40I2N Attributes
Type | Description | Select |
---|---|---|
Mfr | Intel | |
Series | Stratix® V GX | |
Package | Tray | |
Number of LABs/CLBs | 185000 | |
Number of Logic Elements/Cells | 490000 | |
Total RAM Bits | 46080000 | |
Number of I/O | 696 | |
Voltage - Supply | 0.87V ~ 0.93V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 1517-BBGA, FCBGA | |
Supplier Device Package | 1517-FBGA (40x40) | |
Base Product Number | 5SGXMA5 |
5SGXMA5K2F40I2N Datasheet Download
5SGXMA5K2F40I2N Overview
The 5SGXMA5K2F40I2N is a high-performance FPGA chip from Altera Corporation. It is part of the Stratix V family of FPGAs and is designed to deliver high levels of performance, power efficiency, and system integration.
The 5SGXMA5K2F40I2N features 40,000 logic elements and up to 1,872 18×18 multipliers. It also has a total of 1.2 million system gates, with up to 1,024 3.2 Gbps transceivers and up to 1,024 10-bit ADC/DACs. It has a total of 8.2Mb of embedded memory, including 2.6Mb of RAM and 5.6Mb of ROM. It also features two independent PCI Express Gen2 x4 interfaces, with up to 4GB/s of bandwidth.
The 5SGXMA5K2F40I2N is suitable for a wide range of applications, including high-end networking, video and image processing, and embedded systems. It is capable of delivering up to 1.2TFLOPS of peak performance, and it is ideal for applications that require high-speed data processing and real-time analysis.
The 5SGXMA5K2F40I2N is available in a range of packages, including a flip-chip ball grid array (FCBGA) package, a fine-pitch ball grid array (FPBGA) package, and a pin-grid array (PGA) package. It is also available in a range of temperature grades, from industrial (-40°C to +85°C) to extended (-40°C to +105°C).
In summary, the 5SGXMA5K2F40I2N is a high-performance FPGA chip from Altera Corporation. It features 40,000 logic elements, 1.2 million system gates, 8.2Mb of embedded memory, and up to 1.2TFLOPS of peak performance. It is suitable for a wide range of applications, including high-end networking, video and image processing, and embedded systems. It is available in a range of packages and temperature grades.
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