5SGXMA3K1F35C2G
5SGXMA3K1F35C2G
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

5SGXMA3K1F35C2G


5SGXMA3K1F35C2G
F18-5SGXMA3K1F35C2G
Active
FIELD PROGRAMMABLE GATE ARRAY
1152-FBGA (35x35)

5SGXMA3K1F35C2G ECAD Model


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5SGXMA3K1F35C2G Attributes


Type Description Select
Part Life Cycle Code Active
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Ihs Manufacturer INTEL CORP
Reach Compliance Code compliant
HTS Code 8542.39.00.01

5SGXMA3K1F35C2G Datasheet Download


5SGXMA3K1F35C2G Overview



Chip model 5SGXMA3K1F35C2G is a cutting-edge semiconductor chip designed to meet the needs of today’s ever-evolving industry. It is a highly efficient, low-power, low-cost solution for a variety of applications and has been designed to provide the highest level of performance and reliability.


The chip model 5SGXMA3K1F35C2G offers a number of advantages that make it an ideal choice for a wide range of applications. It is designed to be highly efficient, consuming less power and providing more performance than other chips of similar size and cost. This chip also features a low-cost design that makes it an attractive choice for many industries. Additionally, its small size makes it suitable for a variety of applications, including those requiring small form factor devices.


The chip model 5SGXMA3K1F35C2G is expected to see increasing demand in the coming years as more industries begin to adopt it. Its low-cost, high-efficiency design makes it an attractive option for a variety of industries, including automotive, consumer electronics, medical, and industrial. Additionally, its small size and low power consumption make it an ideal choice for many advanced communication systems.


The chip model 5SGXMA3K1F35C2G was designed with the intention of providing a low-cost, high-performance solution for a variety of applications. It features a number of features that make it suitable for a wide range of applications, including an integrated circuit (IC) design that is optimized for low power consumption, a high-speed interface that supports multiple data types, and a wide range of analog and digital I/O capabilities. Additionally, it has been designed to be easily upgradeable, allowing for future upgrades to meet the demands of the ever-evolving industry.


The chip model 5SGXMA3K1F35C2G has been designed to meet specific design requirements and is suitable for a variety of applications. It is capable of providing a wide range of analog and digital I/O capabilities, making it suitable for a variety of applications. Additionally, its high-speed interface makes it suitable for advanced communication systems.


Case studies have been conducted to demonstrate the effectiveness of the chip model 5SGXMA3K1F35C2G in a variety of applications. These studies have shown that the chip model is capable of providing superior performance and reliability, as well as a low-cost, low-power solution for a variety of applications. Additionally, these studies have demonstrated that the chip model is capable of being easily upgraded to meet the demands of the ever-evolving industry.


When using the chip model 5SGXMA3K1F35C2G, it is important to take certain precautions. These include ensuring that the chip is properly cooled, as high temperatures can cause the chip to overheat and become damaged. Additionally, it is important to ensure that the chip is properly connected to the power supply, as improper connections can cause the chip to malfunction or even become damaged. Finally, it is important to ensure that the chip is properly configured, as incorrect settings can lead to unexpected results.


In summary, the chip model 5SGXMA3K1F35C2G is a cutting-edge semiconductor chip designed to meet the needs of today’s ever-evolving industry. It is a highly efficient, low-power, low-cost solution for a variety of applications and has been designed to provide the highest level of performance and reliability. It is expected to see increasing demand in the coming years, as more industries begin to adopt it. Additionally, its small size, low-cost design, and high-speed interface make it suitable for a variety of applications, including advanced communication systems. Finally, case studies have demonstrated the effectiveness of the chip model in a variety of applications, and certain precautions should be taken when using the chip model to ensure proper operation.



5,018 In Stock


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Unit Price: $5,767.024
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Pricing (USD)

QTY Unit Price Ext Price
1+ $5,363.3323 $5,363.3323
10+ $5,305.6621 $53,056.6208
100+ $5,017.3109 $501,731.0880
1000+ $4,728.9597 $2,364,479.8400
10000+ $4,325.2680 $4,325,268.0000
The price is for reference only, please refer to the actual quotation!

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