
Intel Corporation
5SGXMA3H3F35I3LN
5SGXMA3H3F35I3LN ECAD Model
5SGXMA3H3F35I3LN Attributes
Type | Description | Select |
---|---|---|
Mfr | Intel | |
Series | Stratix® V GX | |
Package | Tray | |
Number of LABs/CLBs | 128300 | |
Number of Logic Elements/Cells | 340000 | |
Total RAM Bits | 19456000 | |
Number of I/O | 600 | |
Voltage - Supply | 0.82V ~ 0.88V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 1152-BBGA, FCBGA | |
Supplier Device Package | 1152-FBGA (35x35) | |
Base Product Number | 5SGXMA3 |
5SGXMA3H3F35I3LN Datasheet Download
5SGXMA3H3F35I3LN Overview
The 5SGXMA3H3F35I3LN is a high-performance, low-power, low-cost, field-programmable gate array (FPGA) manufactured by Altera Corporation. It is based on the Stratix V architecture and is capable of delivering up to 9.4 Gbps of single-ended transceiver performance. It is designed to provide an optimal balance of performance, power and cost for a wide range of applications.
The 5SGXMA3H3F35I3LN has a total of 5,096 logic elements and 5,096 memory bits. It also offers up to 1,936 18x18 multipliers and up to 4,096 DSP blocks. It has up to 8,192 digital signal processing (DSP) blocks, up to 4,096 embedded memory blocks, and up to 4,096 I/O pins. The device also features up to 48 transceivers, up to 4,096 user I/O pins, and up to 4,096 differential I/O pins.
The 5SGXMA3H3F35I3LN is suitable for a wide range of applications, including high-speed networking, video and image processing, and embedded systems. It can be used in applications such as wireless infrastructure, medical imaging, and military systems. It is also suitable for automotive, aerospace, and industrial applications.
The device offers a wide range of features, including low static and dynamic power consumption, high-speed transceivers, and a high-performance logic fabric. It is also available in a range of package options, including a 5.5mm x 5.5mm BGA package.
In summary, the 5SGXMA3H3F35I3LN is a high-performance, low-power, low-cost FPGA that is suitable for a wide range of applications. It offers a wide range of features, including low static and dynamic power consumption, high-speed transceivers, and a high-performance logic fabric. It is available in a range of package options and is suitable for applications such as high-speed networking, video and image processing, and embedded systems.
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