5SGXMA3H3F35C2N
5SGXMA3H3F35C2N
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Intel Corporation

5SGXMA3H3F35C2N


5SGXMA3H3F35C2N
F18-5SGXMA3H3F35C2N
Active
IC FPGA 600 I/O 1152FBGA
1152-FBGA (35x35)

5SGXMA3H3F35C2N ECAD Model


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5SGXMA3H3F35C2N Attributes


Type Description Select
Mfr Intel
Series Stratix® V GX
Package Tray
Number of LABs/CLBs 128300
Number of Logic Elements/Cells 340000
Total RAM Bits 19456000
Number of I/O 600
Voltage - Supply 0.87V ~ 0.93V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FBGA (35x35)
Base Product Number 5SGXMA3

5SGXMA3H3F35C2N Datasheet Download


5SGXMA3H3F35C2N Overview



The 5SGXMA3H3F35C2N is a Stratix 10 FPGA chip model produced by Altera, a subsidiary of Intel Corporation. It is a mid-range FPGA device with a capacity of up to 8.7 million logic elements and up to 1.5 million embedded RAM bits. It is based on the 28nm process technology and has a total power consumption of around 17.5W.


The 5SGXMA3H3F35C2N is a highly flexible device, capable of supporting both hard and soft logic designs. It features a range of transceivers, including up to 36 transceivers with up to 28.1 Gbps of transceiver bandwidth, as well as a range of high-speed memory interfaces, including DDR3, QDRII, RLDRAM3, and HMC. It also features a wide range of I/O options, including single-ended, differential, LVDS, and HSTL.


The 5SGXMA3H3F35C2N is suitable for a wide range of applications, including automotive, industrial, and medical. It is ideal for applications that require high-speed data processing and communication, such as video processing, image processing, and communication systems. It is also suitable for applications that require high-performance embedded systems, such as industrial control systems and robotics.


Overall, the 5SGXMA3H3F35C2N is a powerful, highly flexible, and energy-efficient FPGA chip model that is suitable for a wide range of applications. It has a wide range of features and I/O options, making it an excellent choice for embedded systems, communication systems, and other high-performance applications.



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