5SGXMA3H2F35I3N
5SGXMA3H2F35I3N
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Intel Corporation

5SGXMA3H2F35I3N


5SGXMA3H2F35I3N
F18-5SGXMA3H2F35I3N
Active
IC FPGA 600 I/O 1152FBGA
1152-FBGA (35x35)

5SGXMA3H2F35I3N ECAD Model


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5SGXMA3H2F35I3N Attributes


Type Description Select
Mfr Intel
Series Stratix® V GX
Package Tray
Number of LABs/CLBs 128300
Number of Logic Elements/Cells 340000
Total RAM Bits 19456000
Number of I/O 600
Voltage - Supply 0.82V ~ 0.88V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FBGA (35x35)
Base Product Number 5SGXMA3

5SGXMA3H2F35I3N Datasheet Download


5SGXMA3H2F35I3N Overview



The 5SGXMA3H2F35I3N is an advanced FPGA chip model manufactured by Altera. It is a 28nm device that is suitable for a variety of applications such as communications, computer vision, industrial automation, and embedded systems.


The 5SGXMA3H2F35I3N has a total of 2,280,640 logic elements, and up to 1,835,840 flip-flops, as well as a total of 4,561,280 memory bits. It also has a total of 1,150,240 logic cells and a total of 6,912 I/O pins. It is also capable of supporting up to 8096 user-defined I/O standards.


The 5SGXMA3H2F35I3N has a maximum clock frequency of up to 600MHz, and a maximum operating temperature of up to 105°C. It also has a total power dissipation of up to 40.2W.


The 5SGXMA3H2F35I3N is suitable for a variety of applications such as high-speed communications, computer vision, industrial automation, and embedded systems. It is also suitable for use in high-performance computing, networking, and storage applications.


The 5SGXMA3H2F35I3N is a highly advanced FPGA chip model that is suitable for a variety of applications. It has a total of 2,280,640 logic elements, and up to 1,835,840 flip-flops, as well as a total of 4,561,280 memory bits. It has a maximum clock frequency of up to 600MHz, and a maximum operating temperature of up to 105°C. It is suitable for high-speed communications, computer vision, industrial automation, and embedded systems.



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