5SGXEBBR3H43I3LN
5SGXEBBR3H43I3LN
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Intel Corporation

5SGXEBBR3H43I3LN


5SGXEBBR3H43I3LN
F18-5SGXEBBR3H43I3LN
Active
IC FPGA 600 I/O 1760HBGA
1760-HBGA (45x45)

5SGXEBBR3H43I3LN ECAD Model


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5SGXEBBR3H43I3LN Attributes


Type Description Select
Mfr Intel
Series Stratix® V GX
Package Tray
Number of LABs/CLBs 359200
Number of Logic Elements/Cells 952000
Total RAM Bits 53248000
Number of I/O 600
Voltage - Supply 0.82V ~ 0.88V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1760-BBGA, FCBGA
Supplier Device Package 1760-HBGA (45x45)
Base Product Number 5SGXEBB

5SGXEBBR3H43I3LN Datasheet Download


5SGXEBBR3H43I3LN Overview



The 5SGXEBBR3H43I3LN is a high-performance, low-power, radiation-tolerant FPGA chip model manufactured by Altera. It is designed for use in a wide range of applications, including space-based systems, high-performance computing, and industrial automation.


The 5SGXEBBR3H43I3LN features a maximum capacity of 3.4 million logic elements, with up to 6.2 million logic elements available in a single device. It also features up to 6.2 million embedded RAM blocks and up to 5.3 million flip-flops. The device also includes up to 1,024 configurable I/O pins, with support for multiple voltage levels.


The 5SGXEBBR3H43I3LN is designed for use in harsh environments, with radiation tolerance of up to 100Krad (Si) for total dose and up to 1Krad (Si) for single event effects. It is also designed to operate over a wide temperature range, from -40°C to 125°C.


The 5SGXEBBR3H43I3LN is designed for use in a wide range of applications, including aerospace, defense, industrial automation, medical, and automotive. It can be used in applications such as image processing, signal processing, motor control, and communication systems. It is also suitable for applications that require high performance and low power consumption.



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