
Intel Corporation
5SGXEBBR1H43C2LN
5SGXEBBR1H43C2LN ECAD Model
5SGXEBBR1H43C2LN Attributes
Type | Description | Select |
---|---|---|
Mfr | Intel | |
Series | Stratix® V GX | |
Package | Tray | |
Number of LABs/CLBs | 359200 | |
Number of Logic Elements/Cells | 952000 | |
Total RAM Bits | 53248000 | |
Number of I/O | 600 | |
Voltage - Supply | 0.82V ~ 0.88V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 1760-BBGA, FCBGA | |
Supplier Device Package | 1760-HBGA (45x45) | |
Base Product Number | 5SGXEBB |
5SGXEBBR1H43C2LN Datasheet Download
5SGXEBBR1H43C2LN Overview
The 5SGXEBBR1H43C2LN is an FPGA chip model manufactured by Altera Corporation. It is a high-performance, low-power, and low-cost FPGA. It is based on the Stratix V GX architecture and is available in a variety of package sizes.
The 5SGXEBBR1H43C2LN has a total of 3,872,800 logic elements, 1,408 18-Kb RAM blocks and 4,096 DSP blocks. It also has 6,816 user I/Os and up to 6,144 user I/O pins. The chip has a maximum operating frequency of 850 MHz and a maximum power dissipation of 22.4 W. It is built on a 28 nm process and has a die size of 554 mm2.
The 5SGXEBBR1H43C2LN is suitable for a variety of applications including high-speed networking, signal processing, video and image processing, and embedded systems. It is also suitable for applications such as medical imaging, industrial automation, aerospace, and defense.
The 5SGXEBBR1H43C2LN is a low-cost and high-performance FPGA chip model that is suitable for a variety of applications. It is built on a 28 nm process and has a die size of 554 mm2. It has a maximum operating frequency of 850 MHz and a maximum power dissipation of 22.4 W. Its features and specifications make it an ideal choice for a variety of applications.
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