5SGXEB9R3H43I3N
5SGXEB9R3H43I3N
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Intel Corporation

5SGXEB9R3H43I3N


5SGXEB9R3H43I3N
F18-5SGXEB9R3H43I3N
Active
IC FPGA 600 I/O 1760HBGA
1760-HBGA (45x45)

5SGXEB9R3H43I3N ECAD Model


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5SGXEB9R3H43I3N Attributes


Type Description Select
Mfr Intel
Series Stratix® V GX
Package Tray
Number of LABs/CLBs 317000
Number of Logic Elements/Cells 840000
Total RAM Bits 53248000
Number of I/O 600
Voltage - Supply 0.82V ~ 0.88V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1760-BBGA, FCBGA
Supplier Device Package 1760-HBGA (45x45)
Base Product Number 5SGXEB9

5SGXEB9R3H43I3N Datasheet Download


5SGXEB9R3H43I3N Overview



The 5SGXEB9R3H43I3N chip is an FPGA (Field Programmable Gate Array) device from Altera Corporation. It is part of the Stratix V family of devices and is designed to provide high-performance, low-power solutions for a variety of applications.


The 5SGXEB9R3H43I3N is a high-density FPGA with a capacity of up to 1.5 million logic elements. It has a total of 576 18-bit DSP blocks, and up to 1,024 18x18 multipliers. It also features up to 3,072 18-bit embedded memory blocks, and up to 8,192 18-bit RAM blocks. The device has a total of 1,536Kbits of on-chip memory.


The 5SGXEB9R3H43I3N is designed to deliver high performance, low power, and low cost solutions for a variety of applications. It is suitable for high-end embedded systems and applications that require high-speed data processing. It is also suitable for applications such as digital signal processing, video and image processing, computer vision, industrial automation, and networking.


The 5SGXEB9R3H43I3N chip supports various I/O standards, including LVDS, SSTL, and HSTL. It also has a wide range of built-in features, such as a clock management system, on-chip memory, and a power management system. The device is available in a variety of packages, including a 576-pin FBGA, a 576-pin BGA, and a 576-pin LFBGA.


Overall, the 5SGXEB9R3H43I3N chip is a high-performance, low-power FPGA device from Altera Corporation. It is suitable for a variety of applications, including embedded systems, digital signal processing, video and image processing, computer vision, industrial automation, and networking. It is available in a variety of packages and features a wide range of built-in features.



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