
Intel Corporation
5SGXEB9R3H43I3N
5SGXEB9R3H43I3N ECAD Model
5SGXEB9R3H43I3N Attributes
Type | Description | Select |
---|---|---|
Mfr | Intel | |
Series | Stratix® V GX | |
Package | Tray | |
Number of LABs/CLBs | 317000 | |
Number of Logic Elements/Cells | 840000 | |
Total RAM Bits | 53248000 | |
Number of I/O | 600 | |
Voltage - Supply | 0.82V ~ 0.88V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 1760-BBGA, FCBGA | |
Supplier Device Package | 1760-HBGA (45x45) | |
Base Product Number | 5SGXEB9 |
5SGXEB9R3H43I3N Datasheet Download
5SGXEB9R3H43I3N Overview
The 5SGXEB9R3H43I3N chip is an FPGA (Field Programmable Gate Array) device from Altera Corporation. It is part of the Stratix V family of devices and is designed to provide high-performance, low-power solutions for a variety of applications.
The 5SGXEB9R3H43I3N is a high-density FPGA with a capacity of up to 1.5 million logic elements. It has a total of 576 18-bit DSP blocks, and up to 1,024 18x18 multipliers. It also features up to 3,072 18-bit embedded memory blocks, and up to 8,192 18-bit RAM blocks. The device has a total of 1,536Kbits of on-chip memory.
The 5SGXEB9R3H43I3N is designed to deliver high performance, low power, and low cost solutions for a variety of applications. It is suitable for high-end embedded systems and applications that require high-speed data processing. It is also suitable for applications such as digital signal processing, video and image processing, computer vision, industrial automation, and networking.
The 5SGXEB9R3H43I3N chip supports various I/O standards, including LVDS, SSTL, and HSTL. It also has a wide range of built-in features, such as a clock management system, on-chip memory, and a power management system. The device is available in a variety of packages, including a 576-pin FBGA, a 576-pin BGA, and a 576-pin LFBGA.
Overall, the 5SGXEB9R3H43I3N chip is a high-performance, low-power FPGA device from Altera Corporation. It is suitable for a variety of applications, including embedded systems, digital signal processing, video and image processing, computer vision, industrial automation, and networking. It is available in a variety of packages and features a wide range of built-in features.
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