5SGXEB9R3H43C2LN
5SGXEB9R3H43C2LN
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rohs

Intel Corporation

5SGXEB9R3H43C2LN


5SGXEB9R3H43C2LN
F18-5SGXEB9R3H43C2LN
Active
IC FPGA 600 I/O 1760HBGA
1760-HBGA (45x45)

5SGXEB9R3H43C2LN ECAD Model


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5SGXEB9R3H43C2LN Attributes


Type Description Select
Mfr Intel
Series Stratix® V GX
Package Tray
Number of LABs/CLBs 317000
Number of Logic Elements/Cells 840000
Total RAM Bits 53248000
Number of I/O 600
Voltage - Supply 0.82V ~ 0.88V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 1760-BBGA, FCBGA
Supplier Device Package 1760-HBGA (45x45)
Base Product Number 5SGXEB9

5SGXEB9R3H43C2LN Datasheet Download


5SGXEB9R3H43C2LN Overview



The 5SGXEB9R3H43C2LN is an integrated circuit (IC) manufactured by Altera Corporation. It is a member of the Stratix V family of FPGAs (Field Programmable Gate Arrays). It is a high-end device that offers a wide range of features and capabilities.


The 5SGXEB9R3H43C2LN is a high-performance FPGA with a total of 4,096 logic elements and over 1 million system logic cells. It has a total of 72 transceiver channels, each with up to 28 Gbps data rate. It also features an on-chip memory of 32 MB, which can be used for storing configuration data and other user data. The device also has a total of 4,096 dedicated RAM blocks, with each block having a total of 18 Kbits of RAM.


The 5SGXEB9R3H43C2LN is suitable for a wide range of applications, including data processing, image processing, video processing, communications, and embedded systems. It is also suitable for high-speed networking applications, such as 10G Ethernet, PCIe, and Fibre Channel.


The device has a power consumption of 5.5 W, making it suitable for low-power applications. It is also capable of operating at temperatures ranging from -40°C to +85°C. The device is packaged in a 556-pin FCBGA package and is RoHS compliant.


In conclusion, the 5SGXEB9R3H43C2LN is a high-performance FPGA with a wide range of features and capabilities. It is suitable for a wide range of applications, including data processing, image processing, video processing, communications, and embedded systems. It is also capable of operating at temperatures ranging from -40°C to +85°C and has a power consumption of 5.5 W.



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