
Intel Corporation
5SGXEB6R3F43I3
5SGXEB6R3F43I3 ECAD Model
5SGXEB6R3F43I3 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 850 mV | |
Number of Inputs | 600 | |
Number of Outputs | 600 | |
Number of Logic Cells | 597000 | |
Number of CLBs | 22540 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 22540 CLBS | |
Power Supplies | 0.85,1.5,2.5,2.5/3,1.2/3 V | |
Supply Voltage-Max | 880 mV | |
Supply Voltage-Min | 820 mV | |
JESD-30 Code | S-PBGA-B1760 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Number of Terminals | 1760 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1760,42X42,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 3.4 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1760,42X42,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A001.A.7.B | |
HTS Code | 8542.39.00.01 |
5SGXEB6R3F43I3 Datasheet Download
5SGXEB6R3F43I3 Overview
The chip model 5SGXEB6R3F43I3 is a cutting-edge semiconductor device that offers a variety of features and capabilities to meet the needs of modern industries. Developed by Intel, this chip model is designed to be used in a variety of applications, including communications, networking, and industrial automation. It is a highly advanced device that combines the latest technology with the highest levels of performance, reliability, and efficiency.
The 5SGXEB6R3F43I3 chip model has several advantages over other similar products. It is capable of handling high-speed data transmission, allowing for faster communication and networking. It is also designed with a low power draw, making it highly energy efficient. In addition, the chip model is highly reliable, with a long lifespan and low maintenance requirements. Finally, the chip model is designed with a wide range of features, including advanced security protocols, high-speed data transmission, and a wide range of ports and connectors.
The 5SGXEB6R3F43I3 chip model is expected to see a significant increase in demand in the coming years. This is due to its combination of advanced features and high performance, as well as its ability to be used in a wide range of applications. It is also expected to be used in a variety of advanced communication systems, due to its high speed data transmission capabilities and advanced security protocols.
The 5SGXEB6R3F43I3 chip model is designed with a variety of features and capabilities to meet the needs of modern industries. It is designed with advanced security protocols, high-speed data transmission, and a wide range of ports and connectors. In addition, the chip model is designed with a low power draw, making it highly energy efficient. Finally, the chip model is highly reliable, with a long lifespan and low maintenance requirements.
The 5SGXEB6R3F43I3 chip model is also designed with the possibility of future upgrades, allowing it to be used in a wide range of applications. This includes the use of advanced communication systems, such as 5G and 6G networks. In addition, the chip model can also be used in a variety of industrial automation applications.
In order to ensure the successful use of the 5SGXEB6R3F43I3 chip model, it is important to understand its specific design requirements. This includes the need for a high-speed data transmission, advanced security protocols, and a wide range of ports and connectors. In addition, it is important to understand the specific requirements of the application, as well as the necessary precautions.
The 5SGXEB6R3F43I3 chip model has already been used in a variety of case studies, demonstrating its ability to meet the needs of modern industries. These case studies include the use of the chip model in a variety of communication systems, as well as in industrial automation applications. This demonstrates the chip model's ability to meet the needs of modern industries, while also providing a high level of reliability, efficiency, and performance.
In conclusion, the 5SGXEB6R3F43I3 chip model is an advanced semiconductor device that offers a variety of features and capabilities to meet the needs of modern industries. It is capable of handling high-speed data transmission, allowing for faster communication and networking. It is also designed with a low power draw, making it highly energy efficient. In addition, the chip model is designed with a wide range of features, including advanced security protocols, high-speed data transmission, and a wide range of ports and connectors. Furthermore, the chip model is designed with the possibility of future upgrades, allowing it to be used in a wide range of applications. Finally, it is important to understand the specific design requirements of the chip model, as well as the necessary precautions, in order to ensure its successful use.
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2,906 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $11,873.3472 | $11,873.3472 |
10+ | $11,745.6768 | $117,456.7680 |
100+ | $11,107.3248 | $1,110,732.4800 |
1000+ | $10,468.9728 | $5,234,486.4000 |
10000+ | $9,575.2800 | $9,575,280.0000 |
The price is for reference only, please refer to the actual quotation! |