5SGXEB6R3F43I3
5SGXEB6R3F43I3
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

5SGXEB6R3F43I3


5SGXEB6R3F43I3
F18-5SGXEB6R3F43I3
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA, BGA1760,42X42,40
BGA, BGA1760,42X42,40

5SGXEB6R3F43I3 ECAD Model


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5SGXEB6R3F43I3 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 850 mV
Number of Inputs 600
Number of Outputs 600
Number of Logic Cells 597000
Number of CLBs 22540
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Organization 22540 CLBS
Power Supplies 0.85,1.5,2.5,2.5/3,1.2/3 V
Supply Voltage-Max 880 mV
Supply Voltage-Min 820 mV
JESD-30 Code S-PBGA-B1760
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Number of Terminals 1760
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1760,42X42,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 3.4 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA1760,42X42,40
Reach Compliance Code compliant
ECCN Code 3A001.A.7.B
HTS Code 8542.39.00.01

5SGXEB6R3F43I3 Datasheet Download


5SGXEB6R3F43I3 Overview



The chip model 5SGXEB6R3F43I3 is a cutting-edge semiconductor device that offers a variety of features and capabilities to meet the needs of modern industries. Developed by Intel, this chip model is designed to be used in a variety of applications, including communications, networking, and industrial automation. It is a highly advanced device that combines the latest technology with the highest levels of performance, reliability, and efficiency.


The 5SGXEB6R3F43I3 chip model has several advantages over other similar products. It is capable of handling high-speed data transmission, allowing for faster communication and networking. It is also designed with a low power draw, making it highly energy efficient. In addition, the chip model is highly reliable, with a long lifespan and low maintenance requirements. Finally, the chip model is designed with a wide range of features, including advanced security protocols, high-speed data transmission, and a wide range of ports and connectors.


The 5SGXEB6R3F43I3 chip model is expected to see a significant increase in demand in the coming years. This is due to its combination of advanced features and high performance, as well as its ability to be used in a wide range of applications. It is also expected to be used in a variety of advanced communication systems, due to its high speed data transmission capabilities and advanced security protocols.


The 5SGXEB6R3F43I3 chip model is designed with a variety of features and capabilities to meet the needs of modern industries. It is designed with advanced security protocols, high-speed data transmission, and a wide range of ports and connectors. In addition, the chip model is designed with a low power draw, making it highly energy efficient. Finally, the chip model is highly reliable, with a long lifespan and low maintenance requirements.


The 5SGXEB6R3F43I3 chip model is also designed with the possibility of future upgrades, allowing it to be used in a wide range of applications. This includes the use of advanced communication systems, such as 5G and 6G networks. In addition, the chip model can also be used in a variety of industrial automation applications.


In order to ensure the successful use of the 5SGXEB6R3F43I3 chip model, it is important to understand its specific design requirements. This includes the need for a high-speed data transmission, advanced security protocols, and a wide range of ports and connectors. In addition, it is important to understand the specific requirements of the application, as well as the necessary precautions.


The 5SGXEB6R3F43I3 chip model has already been used in a variety of case studies, demonstrating its ability to meet the needs of modern industries. These case studies include the use of the chip model in a variety of communication systems, as well as in industrial automation applications. This demonstrates the chip model's ability to meet the needs of modern industries, while also providing a high level of reliability, efficiency, and performance.


In conclusion, the 5SGXEB6R3F43I3 chip model is an advanced semiconductor device that offers a variety of features and capabilities to meet the needs of modern industries. It is capable of handling high-speed data transmission, allowing for faster communication and networking. It is also designed with a low power draw, making it highly energy efficient. In addition, the chip model is designed with a wide range of features, including advanced security protocols, high-speed data transmission, and a wide range of ports and connectors. Furthermore, the chip model is designed with the possibility of future upgrades, allowing it to be used in a wide range of applications. Finally, it is important to understand the specific design requirements of the chip model, as well as the necessary precautions, in order to ensure its successful use.



2,906 In Stock


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Unit Price: $12,767.04
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Pricing (USD)

QTY Unit Price Ext Price
1+ $11,873.3472 $11,873.3472
10+ $11,745.6768 $117,456.7680
100+ $11,107.3248 $1,110,732.4800
1000+ $10,468.9728 $5,234,486.4000
10000+ $9,575.2800 $9,575,280.0000
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