5SGXEB6R3F40I3N
5SGXEB6R3F40I3N
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rohs

Intel Corporation

5SGXEB6R3F40I3N


5SGXEB6R3F40I3N
F18-5SGXEB6R3F40I3N
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-1517
FBGA-1517

5SGXEB6R3F40I3N ECAD Model


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5SGXEB6R3F40I3N Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 850 mV
Number of Inputs 432
Number of Outputs 432
Number of Logic Cells 597000
Number of CLBs 22540
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Organization 22540 CLBS
Power Supplies 0.85,1.5,2.5,2.5/3,1.2/3 V
Supply Voltage-Max 880 mV
Supply Voltage-Min 820 mV
JESD-30 Code S-PBGA-B1517
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1517,39X39,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer INTEL CORP
Package Description FBGA-1517
Reach Compliance Code compliant
ECCN Code 3A001.A.7.B
HTS Code 8542.39.00.01

5SGXEB6R3F40I3N Datasheet Download


5SGXEB6R3F40I3N Overview



The chip model 5SGXEB6R3F40I3N is an advanced and powerful device that is suitable for a variety of applications, such as high-performance digital signal processing, embedded processing, and image processing. It is designed to provide high-speed, low-power performance in a small package. The chip is designed using a high-level hardware description language (HDL) and is capable of being upgraded to meet advanced communication system requirements.


The 5SGXEB6R3F40I3N chip has a number of features that make it suitable for a variety of applications. It has a high-speed, low-power processor core, a high-speed memory controller, and a wide range of peripherals. It also has a variety of interfaces, such as PCI Express, USB, Ethernet, and Serial ATA. The chip is designed to be flexible and can be used in a variety of applications.


The design of the 5SGXEB6R3F40I3N chip is based on the latest technology and is designed to meet the most demanding requirements. It is designed to be robust and reliable and can be used in a wide range of applications. The chip is designed to be easy to use and provides a number of features that make it suitable for a variety of applications.


In addition, the 5SGXEB6R3F40I3N chip can be used in a number of different applications, including high-performance digital signal processing, embedded processing, image processing, and advanced communication systems. The chip is designed to be highly efficient and can be used in a variety of applications. It is designed to provide high-speed, low-power performance in a small package.


When using the 5SGXEB6R3F40I3N chip, there are a number of precautions that should be taken. It is important to ensure that the chip is properly powered and that the clock frequency is set correctly. It is also important to ensure that the chip is properly connected to the system and that the correct settings are used. Additionally, it is important to ensure that the chip is properly programmed and that all necessary software is installed.


Finally, there are a number of case studies that can be used to illustrate how the 5SGXEB6R3F40I3N chip can be used in a variety of applications. These case studies can provide valuable insight into the design and implementation of the chip and can be used to help ensure that the chip is used in the most effective way possible.



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Unit Price: $7,924.0328
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QTY Unit Price Ext Price
1+ $7,369.3505 $7,369.3505
10+ $7,290.1102 $72,901.1018
100+ $6,893.9085 $689,390.8536
1000+ $6,497.7069 $3,248,853.4480
10000+ $5,943.0246 $5,943,024.6000
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