5SGXEB6R2F40I2LN
5SGXEB6R2F40I2LN
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

5SGXEB6R2F40I2LN


5SGXEB6R2F40I2LN
F18-5SGXEB6R2F40I2LN
Active
IC FPGA 432 I/O 1517FBGA
1517-FBGA (40x40)

5SGXEB6R2F40I2LN ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

5SGXEB6R2F40I2LN Attributes


Type Description Select
Mfr Intel
Series Stratix® V GX
Package Tray
Number of LABs/CLBs 225400
Number of Logic Elements/Cells 597000
Total RAM Bits 53248000
Number of I/O 432
Voltage - Supply 0.82V ~ 0.88V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1517-FBGA (40x40)
Supplier Device Package 1517-FBGA (40x40)
Base Product Number 5SGXEB6

5SGXEB6R2F40I2LN Datasheet Download


5SGXEB6R2F40I2LN Overview



The 5SGXEB6R2F40I2LN is an Altera Stratix V FPGA chip model. It is a high-performance device with a wide range of features and capabilities. It is a 28nm device with a total of 40,000 logic elements, 4,096 18x18 multipliers, and 2,048 DSP blocks. It offers up to 8.5Gbps transceiver bandwidth and up to 1.5Tbps internal bandwidth. It also has a large on-chip memory of up to 1.2Mbits.


The 5SGXEB6R2F40I2LN is designed for high-speed, low-power applications. It is well-suited for applications such as high-performance computing, network processing, video and image processing, and embedded systems. It is also suitable for applications that require high-speed data transfer and processing such as communications, storage, and military systems.


The 5SGXEB6R2F40I2LN is available in a range of packages, including a BGA package with a maximum power dissipation of 15W. It is also available in a variety of densities and configurations, allowing designers to customize the chip to their specific needs.


Overall, the 5SGXEB6R2F40I2LN is a powerful, high-performance FPGA chip model with a wide range of features and capabilities. It is suitable for a variety of applications, ranging from communications to military systems. It offers high-speed data transfer and processing, as well as low-power operation. It is available in a range of packages and densities, allowing designers to customize the chip to their specific needs.



3,292 In Stock


I want to buy

Unit Price: N/A
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
No reference price found.

Quick Quote