
Intel Corporation
5SGXEB5R3F43I3
5SGXEB5R3F43I3 ECAD Model
5SGXEB5R3F43I3 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 850 mV | |
Number of Inputs | 600 | |
Number of Outputs | 600 | |
Number of Logic Cells | 490000 | |
Number of CLBs | 18500 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 18500 CLBS | |
Power Supplies | 0.85,1.5,2.5,2.5/3,1.2/3 V | |
Supply Voltage-Max | 880 mV | |
Supply Voltage-Min | 820 mV | |
JESD-30 Code | S-PBGA-B1760 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Number of Terminals | 1760 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1760,42X42,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 3.4 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1760,42X42,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A001.A.7.B | |
HTS Code | 8542.39.00.01 |
5SGXEB5R3F43I3 Datasheet Download
5SGXEB5R3F43I3 Overview
The 5SGXEB5R3F43I3 chip model is an advanced integrated circuit developed by Altera Corporation. It is an ideal choice for high-performance digital signal processing, embedded processing and image processing. This chip model is designed to be used with HDL (Hardware Description Language), which is a type of programming language used to describe the behavior and architecture of digital logic circuits.
The 5SGXEB5R3F43I3 chip model is a powerful tool for engineers and designers. It has a wide range of features, including a high-speed interconnect architecture, a high-performance memory system, and a large number of I/O pins. This chip model also has a high-performance embedded processing system and a low-power imaging processor. It is capable of providing high-speed data processing and image processing capabilities.
When using the 5SGXEB5R3F43I3 chip model, it is important to understand its product description and specific design requirements. It is also important to be aware of the precautions to be taken when using the chip model. This includes understanding the operating environment, the power requirements, and the thermal requirements.
The 5SGXEB5R3F43I3 chip model can be used in the development and popularization of future intelligent robots. This chip model has a high-speed interconnect architecture and a high-performance embedded processing system, which are both important for robots. In addition, the chip model has a low-power imaging processor, which is essential for robots. To use the chip model effectively, engineers and designers should have a good knowledge of HDL programming and a good understanding of the chip model's product description and design requirements.
In conclusion, the 5SGXEB5R3F43I3 chip model is an ideal choice for high-performance digital signal processing, embedded processing, image processing and the development of future intelligent robots. It is important to understand its product description and design requirements, as well as the precautions to be taken when using the chip model. Engineers and designers should have a good knowledge of HDL programming and a good understanding of the chip model's product description and design requirements in order to use the chip model effectively.
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Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $10,078.4918 | $10,078.4918 |
10+ | $9,970.1210 | $99,701.2096 |
100+ | $9,428.2666 | $942,826.6560 |
1000+ | $8,886.4122 | $4,443,206.0800 |
10000+ | $8,127.8160 | $8,127,816.0000 |
The price is for reference only, please refer to the actual quotation! |