
Intel Corporation
5SGXEB5R3F43C2
5SGXEB5R3F43C2 ECAD Model
5SGXEB5R3F43C2 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 600 | |
Number of Outputs | 600 | |
Number of Logic Cells | 490000 | |
Number of CLBs | 18500 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 18500 CLBS | |
Power Supplies | 0.85,1.5,2.5,2.5/3,1.2/3 V | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1760 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 85 °C | |
Number of Terminals | 1760 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1760,42X42,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 3.4 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1760,42X42,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A001.A.7.B | |
HTS Code | 8542.39.00.01 |
5SGXEB5R3F43C2 Datasheet Download
5SGXEB5R3F43C2 Overview
The 5SGXEB5R3F43C2 is an advanced chip model designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to be used with the HDL language, allowing for a more comprehensive and versatile range of applications.
The 5SGXEB5R3F43C2 chip model has become increasingly popular in recent years due to its ability to provide high-performance computing with low power consumption. This has allowed for a variety of industries to benefit from its usage, such as medical imaging, communications, and defense. It is also becoming increasingly popular in the automotive industry, with its ability to provide advanced safety and navigation systems.
When it comes to the industry trends of the 5SGXEB5R3F43C2 chip model and the future development of related industries, it depends on what specific technologies are needed. For example, if a particular application requires the use of artificial intelligence or machine learning, then the chip model may need to be updated to accommodate those technologies. Similarly, if the application requires the use of a new communication protocol, then the chip model may need to be updated to accommodate that as well.
The product description and specific design requirements of the 5SGXEB5R3F43C2 chip model can be found in the documentation provided by the manufacturer. This includes information on the chip’s architecture, power consumption, and other performance metrics. Additionally, the documentation includes actual case studies and precautions to take when using the chip. This is especially important for those who are unfamiliar with the chip model or those who are using it for the first time.
Overall, the 5SGXEB5R3F43C2 chip model is a powerful and versatile piece of technology that can be used for a variety of applications. With its ability to provide high-performance computing with low power consumption, it has become increasingly popular in a number of industries. Furthermore, the product documentation provides a detailed description of the chip model and its design requirements, along with case studies and precautions to consider when using it. With the right knowledge and expertise, the 5SGXEB5R3F43C2 chip model can be used to great effect.
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3,402 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $10,078.4918 | $10,078.4918 |
10+ | $9,970.1210 | $99,701.2096 |
100+ | $9,428.2666 | $942,826.6560 |
1000+ | $8,886.4122 | $4,443,206.0800 |
10000+ | $8,127.8160 | $8,127,816.0000 |
The price is for reference only, please refer to the actual quotation! |