Intel Corporation
5SGXEB5R3F40I4N
5SGXEB5R3F40I4N ECAD Model
5SGXEB5R3F40I4N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 850 mV | |
| Number of Inputs | 432 | |
| Number of Outputs | 432 | |
| Number of Logic Cells | 490000 | |
| Number of CLBs | 18500 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 18500 CLBS | |
| Power Supplies | 0.85,1.5,2.5,2.5/3,1.2/3 V | |
| Supply Voltage-Max | 880 mV | |
| Supply Voltage-Min | 820 mV | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1517 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A001.A.7.B |
5SGXEB5R3F40I4N Datasheet Download
5SGXEB5R3F40I4N Overview
The chip model 5SGXEB5R3F40I4N is a cutting-edge semiconductor device that has been designed to meet the needs of modern communication systems. It is the latest in a line of devices that have been developed to provide high-speed, low-power solutions for a wide range of applications. As such, it is important to understand the industry trends of the chip model and the potential for future development in related industries.
The original design intention of the chip model 5SGXEB5R3F40I4N was to provide a reliable and efficient solution for communication systems. It is equipped with a number of features that allow it to meet the demands of modern communication systems, including a high-speed serial interface, low-power consumption and a wide range of compatible peripherals. Additionally, the chip model is capable of supporting advanced communication systems such as 3G/4G and Wi-Fi.
When considering the potential for future upgrades, it is important to consider the application environment in which the chip model will be used. If the application environment requires the support of new technologies, then the chip model may need to be upgraded in order to meet the demands of the application environment. Additionally, if the application environment requires the support of existing technologies, then the chip model may not need to be upgraded in order to meet the demands of the application environment.
The product description and specific design requirements of the chip model 5SGXEB5R3F40I4N can be found in the device’s datasheet. This document outlines the features of the chip model and provides an overview of the design requirements that must be met in order for the chip model to function correctly. Additionally, the datasheet provides a number of case studies that demonstrate how the chip model can be used in a variety of applications.
When considering the use of the chip model 5SGXEB5R3F40I4N, it is important to take into account the potential risks associated with the device. As such, it is important to ensure that the device is used in accordance with the manufacturer’s instructions and that all safety precautions are taken when using the device. Additionally, it is important to ensure that the device is tested and certified before being used in an application environment.
In conclusion, the chip model 5SGXEB5R3F40I4N is a cutting-edge semiconductor device that has been designed to meet the needs of modern communication systems. It is important to understand the industry trends of the chip model and the potential for future development in related industries. Additionally, it is important to consider the application environment in which the chip model will be used and to ensure that the device is used in accordance with the manufacturer’s instructions and that all safety precautions are taken when using the device.
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1,564 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $5,215.4766 | $5,215.4766 |
| 10+ | $5,159.3962 | $51,593.9625 |
| 100+ | $4,878.9943 | $487,899.4278 |
| 1000+ | $4,598.5923 | $2,299,296.1540 |
| 10000+ | $4,206.0296 | $4,206,029.5500 |
| The price is for reference only, please refer to the actual quotation! | ||