5SGXEB5R3F40I3N
5SGXEB5R3F40I3N
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rohs

Intel Corporation

5SGXEB5R3F40I3N


5SGXEB5R3F40I3N
F18-5SGXEB5R3F40I3N
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-1517
FBGA-1517

5SGXEB5R3F40I3N ECAD Model


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5SGXEB5R3F40I3N Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 850 mV
Number of Inputs 432
Number of Outputs 432
Number of Logic Cells 490000
Number of CLBs 18500
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Organization 18500 CLBS
Power Supplies 0.85,1.5,2.5,2.5/3,1.2/3 V
Supply Voltage-Max 880 mV
Supply Voltage-Min 820 mV
JESD-30 Code S-PBGA-B1517
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1517,39X39,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer INTEL CORP
Package Description FBGA-1517
Reach Compliance Code compliant
HTS Code 8542.39.00.01
ECCN Code 3A001.A.7.B

5SGXEB5R3F40I3N Datasheet Download


5SGXEB5R3F40I3N Overview



The chip model 5SGXEB5R3F40I3N is a high-performance, low-power FPGA device that is designed for a variety of applications including digital signal processing, embedded processing, image processing, and more. It is suitable for use in a variety of systems, including advanced communication systems, and can be used with the HDL language.


The original design intention of the chip model 5SGXEB5R3F40I3N was to provide a high-performance and low-power solution for a variety of applications. It is designed with scalability in mind, allowing for future upgrades and modifications as required. It is also designed to be easily integrated into existing systems, making it a great choice for those looking to upgrade their existing systems.


The product description of the chip model 5SGXEB5R3F40I3N includes its features, specifications, and design requirements. It includes a range of features, including high-speed I/O, high-performance DSP capabilities, and embedded processing. It also includes a range of design requirements, including power consumption, system design, and timing constraints.


The actual case studies and precautions for using the chip model 5SGXEB5R3F40I3N are important to consider when designing a system. It is important to consider the power consumption, system design, and timing constraints when designing a system that uses this chip. It is also important to ensure that the system design is optimized to take advantage of the chip's features and capabilities. Additionally, it is important to consider the system's environment, as the chip may not be suitable for all applications.


Overall, the chip model 5SGXEB5R3F40I3N is a great choice for those looking for a high-performance, low-power FPGA device. It is designed to be easily integrated into existing systems, and is suitable for a variety of applications. It is important to consider the product description, design requirements, and actual case studies and precautions when designing a system that uses this chip.



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Unit Price: $6,705.6224
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Pricing (USD)

QTY Unit Price Ext Price
1+ $6,236.2288 $6,236.2288
10+ $6,169.1726 $61,691.7261
100+ $5,833.8915 $583,389.1488
1000+ $5,498.6104 $2,749,305.1840
10000+ $5,029.2168 $5,029,216.8000
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