
Intel Corporation
5SGXEB5R3F40I3N
5SGXEB5R3F40I3N ECAD Model
5SGXEB5R3F40I3N Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 850 mV | |
Number of Inputs | 432 | |
Number of Outputs | 432 | |
Number of Logic Cells | 490000 | |
Number of CLBs | 18500 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 18500 CLBS | |
Power Supplies | 0.85,1.5,2.5,2.5/3,1.2/3 V | |
Supply Voltage-Max | 880 mV | |
Supply Voltage-Min | 820 mV | |
JESD-30 Code | S-PBGA-B1517 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1517,39X39,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-1517 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A001.A.7.B |
5SGXEB5R3F40I3N Datasheet Download
5SGXEB5R3F40I3N Overview
The chip model 5SGXEB5R3F40I3N is a high-performance, low-power FPGA device that is designed for a variety of applications including digital signal processing, embedded processing, image processing, and more. It is suitable for use in a variety of systems, including advanced communication systems, and can be used with the HDL language.
The original design intention of the chip model 5SGXEB5R3F40I3N was to provide a high-performance and low-power solution for a variety of applications. It is designed with scalability in mind, allowing for future upgrades and modifications as required. It is also designed to be easily integrated into existing systems, making it a great choice for those looking to upgrade their existing systems.
The product description of the chip model 5SGXEB5R3F40I3N includes its features, specifications, and design requirements. It includes a range of features, including high-speed I/O, high-performance DSP capabilities, and embedded processing. It also includes a range of design requirements, including power consumption, system design, and timing constraints.
The actual case studies and precautions for using the chip model 5SGXEB5R3F40I3N are important to consider when designing a system. It is important to consider the power consumption, system design, and timing constraints when designing a system that uses this chip. It is also important to ensure that the system design is optimized to take advantage of the chip's features and capabilities. Additionally, it is important to consider the system's environment, as the chip may not be suitable for all applications.
Overall, the chip model 5SGXEB5R3F40I3N is a great choice for those looking for a high-performance, low-power FPGA device. It is designed to be easily integrated into existing systems, and is suitable for a variety of applications. It is important to consider the product description, design requirements, and actual case studies and precautions when designing a system that uses this chip.
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1,862 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $6,236.2288 | $6,236.2288 |
10+ | $6,169.1726 | $61,691.7261 |
100+ | $5,833.8915 | $583,389.1488 |
1000+ | $5,498.6104 | $2,749,305.1840 |
10000+ | $5,029.2168 | $5,029,216.8000 |
The price is for reference only, please refer to the actual quotation! |