Intel Corporation
5SGXEB5R3F40C3N
5SGXEB5R3F40C3N ECAD Model
5SGXEB5R3F40C3N Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 850 mV | |
| Number of Inputs | 432 | |
| Number of Outputs | 432 | |
| Number of Logic Cells | 490000 | |
| Number of CLBs | 18500 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 18500 CLBS | |
| Power Supplies | 0.85,1.5,2.5,2.5/3,1.2/3 V | |
| Supply Voltage-Max | 880 mV | |
| Supply Voltage-Min | 820 mV | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1517 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A001.A.7.B |
5SGXEB5R3F40C3N Datasheet Download
5SGXEB5R3F40C3N Overview
The chip model 5SGXEB5R3F40C3N is a powerful and versatile solution for high-performance digital signal processing, embedded processing, and image processing. It is designed with a HDL language, making it a great choice for applications requiring powerful performance.
The chip model 5SGXEB5R3F40C3N is designed to meet the needs of today's high-performance applications, such as digital signal processing, embedded processing, and image processing. It is capable of handling complex operations with its powerful architecture and efficient data processing. The chip model 5SGXEB5R3F40C3N has the ability to process multiple data streams simultaneously, making it a great choice for applications requiring high throughput.
The original design intention of the chip model 5SGXEB5R3F40C3N was to provide high-performance, reliable, and efficient solutions for digital signal processing, embedded processing, and image processing. It is designed to be able to handle complex operations with its powerful architecture and efficient data processing. It is also designed to be upgradable, allowing it to be used for advanced communication systems in the future.
In terms of industry trends, the chip model 5SGXEB5R3F40C3N is a great choice for applications requiring powerful performance and efficient data processing. It is designed to be able to handle complex operations and to be upgradable, allowing it to be used for advanced communication systems in the future. It is also designed to be compatible with new technologies, making it a great choice for applications requiring the support of new technologies.
Overall, the chip model 5SGXEB5R3F40C3N is a powerful and versatile solution for high-performance digital signal processing, embedded processing, and image processing. It is designed with a HDL language, making it a great choice for applications requiring powerful performance. It is also designed to be upgradable, allowing it to be used for advanced communication systems in the future. Additionally, it is designed to be compatible with new technologies, making it a great choice for applications requiring the support of new technologies.
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1,990 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $5,215.4766 | $5,215.4766 |
| 10+ | $5,159.3962 | $51,593.9625 |
| 100+ | $4,878.9943 | $487,899.4278 |
| 1000+ | $4,598.5923 | $2,299,296.1540 |
| 10000+ | $4,206.0296 | $4,206,029.5500 |
| The price is for reference only, please refer to the actual quotation! | ||