Intel Corporation
5SGXEB5R2F43C3
5SGXEB5R2F43C3 ECAD Model
5SGXEB5R2F43C3 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 850 mV | |
| Number of Inputs | 600 | |
| Number of Outputs | 600 | |
| Number of Logic Cells | 490000 | |
| Number of CLBs | 18500 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 18500 CLBS | |
| Power Supplies | 0.85,1.5,2.5,2.5/3,1.2/3 V | |
| Supply Voltage-Max | 880 mV | |
| Supply Voltage-Min | 820 mV | |
| JESD-30 Code | S-PBGA-B1760 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 1760 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1760,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | FBGA-1760 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
5SGXEB5R2F43C3 Overview
The 5SGXEB5R2F43C3 is a chip model developed by Altera Corporation, a pioneer in the field of programmable logic solutions. This model is part of the Stratix 10 family of products, and it is designed to meet the needs of high-performance, low-power, and highly reliable applications. It is a powerful, cost-effective solution for a wide range of applications, including embedded systems, communications, and industrial control.
The 5SGXEB5R2F43C3 chip model has several advantages over traditional chips. It features a high-performance, low-power architecture that enables it to be used in a wide range of applications. It also has a flexible, reconfigurable design that allows users to customize their designs to meet their specific requirements. Additionally, the chip model supports a wide range of peripheral and memory interfaces, allowing users to easily integrate their own custom logic and memory.
The demand for the 5SGXEB5R2F43C3 chip model is expected to continue to grow in the future. It is well suited for use in a variety of applications, including industrial control, automotive, consumer electronics, and communications. It is also a cost-effective solution for embedded systems, allowing users to reduce costs while still providing high performance.
The original design intention of the 5SGXEB5R2F43C3 chip model was to provide a powerful, cost-effective solution for a wide range of applications. The chip model is designed to be highly reliable and low-power, and it is capable of supporting a wide range of peripheral and memory interfaces. It is also designed to be easily upgradable, allowing users to customize their designs to meet their specific requirements.
The 5SGXEB5R2F43C3 chip model is also designed to be used in advanced communication systems. It is capable of supporting a wide range of communication protocols, including Ethernet, Wi-Fi, Bluetooth, ZigBee, and more. Additionally, it is capable of supporting a variety of intelligent scenarios, such as machine learning and artificial intelligence. This makes it an ideal choice for use in the era of fully intelligent systems.
In conclusion, the 5SGXEB5R2F43C3 chip model is a powerful, cost-effective solution for a wide range of applications, including industrial control, automotive, consumer electronics, and communications. It is also designed to be highly reliable, low-power, and easily upgradable. Additionally, it is capable of supporting a wide range of communication protocols and intelligent scenarios, making it an ideal choice for use in the era of fully intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||