5SGXEA9K2H40I3L
5SGXEA9K2H40I3L
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Intel Corporation

5SGXEA9K2H40I3L


5SGXEA9K2H40I3L
F18-5SGXEA9K2H40I3L
Active
IC FPGA 696 I/O 1517HBGA
1517-HBGA (45x45)

5SGXEA9K2H40I3L ECAD Model


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5SGXEA9K2H40I3L Attributes


Type Description Select
Mfr Intel
Series Stratix® V GX
Package Tray
Number of LABs/CLBs 317000
Number of Logic Elements/Cells 840000
Total RAM Bits 53248000
Number of I/O 696
Voltage - Supply 0.82V ~ 0.88V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1517-BBGA, FCBGA
Supplier Device Package 1517-HBGA (45x45)
Base Product Number 5SGXEA9

5SGXEA9K2H40I3L Datasheet Download


5SGXEA9K2H40I3L Overview



The 5SGXEA9K2H40I3L is a model of a Field Programmable Gate Array (FPGA) chip manufactured by Altera Corporation. It is based on the Stratix V architecture and is specifically designed for high-performance applications. The chip has a total capacity of 40,960 logic elements, and a total of 4,096 embedded 18x18 Multipliers. It also features 8,192Kbits of embedded memory and up to 1,024 Digital Signal Processing (DSP) blocks. Additionally, it has an embedded transceiver technology with up to 40 Gbps data rate.


The 5SGXEA9K2H40I3L is suitable for a wide range of applications, including high-speed networking, wireless communication, and video processing. It is suitable for applications that require high-speed data transmission, high-performance computing, and low-power operation. Additionally, it is also suitable for applications that require a high degree of scalability and flexibility.


The 5SGXEA9K2H40I3L chip is available in a range of package sizes, including a 5mm x 5mm FineLine BGA package and a 7mm x 7mm FineLine BGA package. It also features an integrated power delivery system, which enables it to operate at a wide range of voltages. Additionally, it has an integrated thermal management system, which ensures that the chip remains cool during operation.


In conclusion, the 5SGXEA9K2H40I3L is a high-performance FPGA chip manufactured by Altera Corporation. It is suitable for a wide range of applications, including high-speed networking, wireless communication, and video processing. It is available in a range of package sizes, and has an integrated power delivery and thermal management system.



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