
Intel Corporation
5SGXEA9K2H40I3L
5SGXEA9K2H40I3L ECAD Model
5SGXEA9K2H40I3L Attributes
Type | Description | Select |
---|---|---|
Mfr | Intel | |
Series | Stratix® V GX | |
Package | Tray | |
Number of LABs/CLBs | 317000 | |
Number of Logic Elements/Cells | 840000 | |
Total RAM Bits | 53248000 | |
Number of I/O | 696 | |
Voltage - Supply | 0.82V ~ 0.88V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 1517-BBGA, FCBGA | |
Supplier Device Package | 1517-HBGA (45x45) | |
Base Product Number | 5SGXEA9 |
5SGXEA9K2H40I3L Datasheet Download
5SGXEA9K2H40I3L Overview
The 5SGXEA9K2H40I3L is a model of a Field Programmable Gate Array (FPGA) chip manufactured by Altera Corporation. It is based on the Stratix V architecture and is specifically designed for high-performance applications. The chip has a total capacity of 40,960 logic elements, and a total of 4,096 embedded 18x18 Multipliers. It also features 8,192Kbits of embedded memory and up to 1,024 Digital Signal Processing (DSP) blocks. Additionally, it has an embedded transceiver technology with up to 40 Gbps data rate.
The 5SGXEA9K2H40I3L is suitable for a wide range of applications, including high-speed networking, wireless communication, and video processing. It is suitable for applications that require high-speed data transmission, high-performance computing, and low-power operation. Additionally, it is also suitable for applications that require a high degree of scalability and flexibility.
The 5SGXEA9K2H40I3L chip is available in a range of package sizes, including a 5mm x 5mm FineLine BGA package and a 7mm x 7mm FineLine BGA package. It also features an integrated power delivery system, which enables it to operate at a wide range of voltages. Additionally, it has an integrated thermal management system, which ensures that the chip remains cool during operation.
In conclusion, the 5SGXEA9K2H40I3L is a high-performance FPGA chip manufactured by Altera Corporation. It is suitable for a wide range of applications, including high-speed networking, wireless communication, and video processing. It is available in a range of package sizes, and has an integrated power delivery and thermal management system.
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