
Intel Corporation
5SGXEA7N3F40I3
5SGXEA7N3F40I3 ECAD Model
5SGXEA7N3F40I3 Attributes
Type | Description | Select |
---|---|---|
Mfr | Intel | |
Series | Stratix® V GX | |
Package | Tray | |
Number of LABs/CLBs | 234720 | |
Number of Logic Elements/Cells | 622000 | |
Total RAM Bits | 51200000 | |
Number of I/O | 600 | |
Voltage - Supply | 0.82V ~ 0.88V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 1517-BBGA, FCBGA | |
Supplier Device Package | 1517-FBGA (40x40) | |
Base Product Number | 5SGXEA7 |
5SGXEA7N3F40I3 Datasheet Download
5SGXEA7N3F40I3 Overview
The 5SGXEA7N3F40I3 chip is a member of the Stratix V family of FPGAs from Altera Corporation. It is a high-performance, low-power, low-cost FPGA that combines the latest in FPGA technology with the power of a 28 nm process. It features up to 6,144 logic elements, up to 6.25 Mbits of memory, and up to 10.2 Gbps transceiver performance. It also supports up to 5.2 Gbps transceivers, up to 5.2 Gbps SerDes, and up to 6.25 Mbits of memory.
The 5SGXEA7N3F40I3 chip is designed for a variety of applications, including high-performance embedded applications, high-speed communications and networking, and video and image processing. It is also ideal for applications requiring high-speed transceivers, high-bandwidth memory, and low-power operation. It is also suitable for high-speed signal processing, high-speed networking, and high-speed data transfer.
The 5SGXEA7N3F40I3 chip is available in a variety of packages, including the BGA and PQFP packages. It is also available in a variety of densities, ranging from the low-density, low-cost 5SGXEA7N3F40I3 to the high-density, high-performance 5SGXEA7N3F40I3-HD. It also supports a wide range of I/O standards, including LVDS, LVCMOS, and SSTL.
In summary, the 5SGXEA7N3F40I3 is a high-performance, low-power, low-cost FPGA that is suitable for a variety of applications. It features up to 6,144 logic elements, up to 6.25 Mbits of memory, and up to 10.2 Gbps transceiver performance. It is available in a variety of packages and densities and supports a wide range of I/O standards.
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