5SGXEA7N1F45C2L
5SGXEA7N1F45C2L
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Intel Corporation

5SGXEA7N1F45C2L


5SGXEA7N1F45C2L
F18-5SGXEA7N1F45C2L
Active
IC FPGA 840 I/O 1932FBGA
1932-FBGA, FC (45x45)

5SGXEA7N1F45C2L ECAD Model


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5SGXEA7N1F45C2L Attributes


Type Description Select
Mfr Intel
Series Stratix® V GX
Package Tray
Number of LABs/CLBs 234720
Number of Logic Elements/Cells 622000
Total RAM Bits 51200000
Number of I/O 840
Voltage - Supply 0.82V ~ 0.88V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 1932-BBGA, FCBGA
Supplier Device Package 1932-FBGA, FC (45x45)
Base Product Number 5SGXEA7

5SGXEA7N1F45C2L Datasheet Download


5SGXEA7N1F45C2L Overview



The 5SGXEA7N1F45C2L is an Altera Stratix V FPGA chip model. It is a low-cost, low-power device that is designed for a wide range of applications. The chip is based on the 40nm low-power process technology and is optimized for high-performance, low-power applications.


The 5SGXEA7N1F45C2L features a total of 4,096 logic elements, which are organized into four layers of logic. Each layer of logic is connected to the other layers via a crossbar switch. This allows for high-speed data routing between the layers and enables the chip to operate at speeds up to 1.2GHz. The chip also features a total of 16,384 flip-flops, which are used to store data and instructions.


The 5SGXEA7N1F45C2L has a total of 24,576 embedded memory blocks, which are organized into four banks. These memory blocks can be used to store data and instructions and can be accessed at speeds up to 1.2GHz. The chip also features a total of four high-speed transceivers, which are used for communications between the chip and external devices.


The 5SGXEA7N1F45C2L is suitable for a wide range of applications, including communications, embedded systems, digital signal processing, and multimedia. The chip is also suitable for use in automotive, industrial, and medical applications. The chip is designed to operate at temperatures ranging from -40°C to +125°C and is available in a range of package sizes, including a 256-pin BGA package.



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