5SGXEA5K3F35I3LN
5SGXEA5K3F35I3LN
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Intel Corporation

5SGXEA5K3F35I3LN


5SGXEA5K3F35I3LN
F18-5SGXEA5K3F35I3LN
Active
IC FPGA 432 I/O 1152FBGA
1152-FBGA (35x35)

5SGXEA5K3F35I3LN ECAD Model


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5SGXEA5K3F35I3LN Attributes


Type Description Select
Mfr Intel
Series Stratix® V GX
Package Tray
Number of LABs/CLBs 185000
Number of Logic Elements/Cells 490000
Total RAM Bits 46080000
Number of I/O 432
Voltage - Supply 0.82V ~ 0.88V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FBGA (35x35)
Base Product Number 5SGXEA5

5SGXEA5K3F35I3LN Datasheet Download


5SGXEA5K3F35I3LN Overview



The 5SGXEA5K3F35I3LN is a chip model developed by Altera Corporation. It is a member of the Stratix V family of FPGAs, and it is based on the 28nm low-power process technology. The chip is designed for high-performance applications, such as video, imaging, networking, and communications.


The 5SGXEA5K3F35I3LN has a total of 5,312 logic elements, which can be used to implement complex logic functions. It also has a total of 5,312 memory blocks, which can be used to store data and instructions. The chip also has a total of 6,144 18x18 multipliers, which can be used to perform fast mathematical operations. Additionally, the chip has a total of 4,608 digital signal processing (DSP) blocks, which can be used to perform signal processing tasks.


The 5SGXEA5K3F35I3LN is capable of operating at a maximum clock frequency of 800 MHz. It has a total of 1,024 user I/O pins, which can be used to connect the chip to external devices. Additionally, the chip has a total of 4,096 dedicated high-speed transceivers, which can be used to transmit and receive data over long distances.


The 5SGXEA5K3F35I3LN is suitable for a wide range of applications, including video processing, image processing, networking, communications, and embedded systems. It is also suitable for high-end applications, such as automotive, aerospace, and defense. The chip is highly reliable and can operate in extreme temperatures and harsh environments.



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