5SGXEA5K2F35I3N
5SGXEA5K2F35I3N
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Intel Corporation

5SGXEA5K2F35I3N


5SGXEA5K2F35I3N
F18-5SGXEA5K2F35I3N
Active
IC FPGA 432 I/O 1152FBGA
1152-FBGA (35x35)

5SGXEA5K2F35I3N ECAD Model


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5SGXEA5K2F35I3N Attributes


Type Description Select
Mfr Intel
Series Stratix® V GX
Package Tray
Number of LABs/CLBs 185000
Number of Logic Elements/Cells 490000
Total RAM Bits 46080000
Number of I/O 432
Voltage - Supply 0.82V ~ 0.88V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FBGA (35x35)
Base Product Number 5SGXEA5

5SGXEA5K2F35I3N Datasheet Download


5SGXEA5K2F35I3N Overview



The 5SGXEA5K2F35I3N is an FPGA chip model designed by Altera Corporation. It is a high-performance, low-power, and low-cost device that is suitable for a wide range of applications.


The 5SGXEA5K2F35I3N is based on the Stratix V GX architecture and is fabricated using a 28 nm low-power process technology. It has a total of 2.5 million logic elements, 5,832 digital signal processing (DSP) blocks, and a total of 1,536 18 x 18 multipliers. It also has a total of 8,192 18Kbit embedded memory blocks and 1,024 I/O pins. The chip also features several high-speed transceivers, including two 10-Gigabit Ethernet transceivers, two 10-Gigabit SFI4.2 transceivers, and two 10-Gigabit XAUI transceivers.


The 5SGXEA5K2F35I3N is suitable for a wide range of applications, including embedded systems, high-performance computing, digital signal processing, and communications. It can be used for applications such as image processing, machine learning, video processing, and networking. It is also suitable for automotive, aerospace, and medical applications.


In conclusion, the 5SGXEA5K2F35I3N is a high-performance, low-power, and low-cost FPGA chip model that is suitable for a wide range of applications. It is based on the Stratix V GX architecture and features a total of 2.5 million logic elements, 5,832 DSP blocks, and 1,536 18 x 18 multipliers. It is suitable for applications such as embedded systems, high-performance computing, digital signal processing, and communications.



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