5SGXEA4K3F40I3N
5SGXEA4K3F40I3N
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Intel Corporation

5SGXEA4K3F40I3N


5SGXEA4K3F40I3N
F18-5SGXEA4K3F40I3N
Active
IC FPGA 696 I/O 1517FBGA
1517-FBGA (40x40)

5SGXEA4K3F40I3N ECAD Model


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5SGXEA4K3F40I3N Attributes


Type Description Select
Mfr Intel
Series Stratix® V GX
Package Tray
Number of LABs/CLBs 158500
Number of Logic Elements/Cells 420000
Total RAM Bits 37888000
Number of I/O 696
Voltage - Supply 0.82V ~ 0.88V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1517-BBGA, FCBGA
Supplier Device Package 1517-FBGA (40x40)
Base Product Number 5SGXEA4

5SGXEA4K3F40I3N Datasheet Download


5SGXEA4K3F40I3N Overview



The 5SGXEA4K3F40I3N is a field programmable gate array (FPGA) chip model manufactured by Altera Corporation. It is designed for use in high-performance applications, such as communications, networking, and video processing. This device is based on the Stratix V architecture and features a maximum capacity of 4,320 logic elements, 4,320 embedded memory blocks, and 160 DSP blocks. It also offers a total of 36,288 logic registers and up to 1,152 general-purpose input/output (GPIO) pins.


The 5SGXEA4K3F40I3N is fabricated using a 40nm process technology and is packaged in a 676-pin flip-chip ball grid array (FCBGA) package. It has a maximum operating temperature range of 0 to 85 degrees Celsius and a maximum junction temperature of 125 degrees Celsius. The device also has a maximum power dissipation of 28.5 watts.


The 5SGXEA4K3F40I3N is suitable for a wide range of applications, including high-speed networking, embedded systems, video processing, and digital signal processing (DSP) applications. It is also suitable for applications that require a high level of performance, such as automotive, industrial, and medical applications. Additionally, the device supports a variety of protocols, such as Ethernet, PCI Express, and USB.


In summary, the 5SGXEA4K3F40I3N is a high-performance FPGA chip model from Altera Corporation. It is based on the Stratix V architecture and offers a maximum capacity of 4,320 logic elements, 4,320 embedded memory blocks, and 160 DSP blocks. It is suitable for a variety of applications, including high-speed networking, embedded systems, video processing, and DSP applications.



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