5SGXEA4H3F35C3N
5SGXEA4H3F35C3N
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Intel Corporation

5SGXEA4H3F35C3N


5SGXEA4H3F35C3N
F18-5SGXEA4H3F35C3N
Active
IC FPGA 552 I/O 1152FBGA
1152-FBGA (35x35)

5SGXEA4H3F35C3N ECAD Model


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5SGXEA4H3F35C3N Attributes


Type Description Select
Mfr Intel
Series Stratix® V GX
Package Tray
Number of LABs/CLBs 158500
Number of Logic Elements/Cells 420000
Total RAM Bits 37888000
Number of I/O 552
Voltage - Supply 0.82V ~ 0.88V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FBGA (35x35)
Base Product Number 5SGXEA4

5SGXEA4H3F35C3N Datasheet Download


5SGXEA4H3F35C3N Overview



The 5SGXEA4H3F35C3N is an Altera FPGA (Field Programmable Gate Array) chip model. It is based on the Stratix V architecture and is manufactured using a 40nm technology. It is a high-performance FPGA with a capacity of up to 35 million system gates and a maximum clock frequency of 600MHz. It is packaged in a 796-pin FBGA (Flip Chip Ball Grid Array) package.


The 5SGXEA4H3F35C3N features a wide range of features, including up to 7,136 logic elements, up to 7,136 18Kbit embedded memory blocks, up to 1,024 variable-precision DSP blocks, up to 8,192 variable-precision multipliers, up to 8,192 variable-precision adders, up to 8,192 variable-precision registers, up to 8,192 variable-precision logic elements, and up to 4,096 variable-precision flip-flops. It also has up to 4,096 I/O pins, up to 2,048 user-configurable I/O banks, up to 6,144 user-configurable memory blocks, up to 1,024 user-configurable DSP blocks, and up to 4,096 user-configurable logic elements.


The 5SGXEA4H3F35C3N is suitable for a wide range of applications, including high-performance computing, communications, storage, industrial automation, medical imaging, and automotive systems. It is also suitable for applications that require high-speed data processing, such as high-speed data transfer, video processing, and image processing. Its features make it suitable for a variety of applications, including digital signal processing, embedded systems, artificial intelligence, and machine learning.



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