5SGXEA3K3F40C2L
5SGXEA3K3F40C2L
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Intel Corporation

5SGXEA3K3F40C2L


5SGXEA3K3F40C2L
F18-5SGXEA3K3F40C2L
Active
IC FPGA 696 I/O 1517FBGA
1517-FBGA (40x40)

5SGXEA3K3F40C2L ECAD Model


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5SGXEA3K3F40C2L Attributes


Type Description Select
Mfr Intel
Series Stratix® V GX
Package Tray
Number of LABs/CLBs 128300
Number of Logic Elements/Cells 340000
Total RAM Bits 19456000
Number of I/O 696
Voltage - Supply 0.82V ~ 0.88V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 1517-BBGA, FCBGA
Supplier Device Package 1517-FBGA (40x40)
Base Product Number 5SGXEA3

5SGXEA3K3F40C2L Datasheet Download


5SGXEA3K3F40C2L Overview



The 5SGXEA3K3F40C2L chip model is a high-performance, low-power FPGA from the Stratix V family. It is designed to meet the needs of a wide range of applications, including digital signal processing, embedded processing, and image processing. It is also suitable for high-speed data transfer and high-performance computing.


The 5SGXEA3K3F40C2L chip model has a number of advantages that make it an attractive option for many applications. It offers a high level of integration, allowing the user to incorporate a wide range of digital components into a single device. It is also designed to be highly reliable and efficient, providing a long-term solution to many applications. Furthermore, the chip model is designed to be highly scalable, allowing it to be used in a variety of different applications.


The 5SGXEA3K3F40C2L chip model is designed to be programmed using the HDL language, which is a high-level language for designing and implementing digital systems. This language is easy to learn and provides a number of powerful features. It is also designed to be highly portable, allowing the user to develop a system that can be easily ported to other hardware platforms.


In terms of product design, the 5SGXEA3K3F40C2L chip model is designed to provide a high degree of flexibility. It is capable of supporting a wide range of peripherals and interfaces, allowing the user to develop a system that is tailored to their specific needs. Furthermore, the chip model is designed to be highly reliable and efficient, providing a long-term solution to many applications.


In terms of actual case studies, the 5SGXEA3K3F40C2L chip model has been used in a number of applications, including industrial automation, automotive systems, and medical devices. In each of these applications, the chip model has been used to provide a high degree of reliability and performance. Furthermore, the chip model has also been used in a number of research projects, demonstrating its potential for use in a wide range of applications.


When designing a system using the 5SGXEA3K3F40C2L chip model, it is important to consider a number of factors. First, it is important to consider the specific requirements of the application. It is also important to consider the available resources and the specific design constraints of the chip model. Finally, it is important to consider the potential risks associated with using the chip model, including potential hardware and software failures.


The demand for the 5SGXEA3K3F40C2L chip model is expected to increase in the future as more applications require high-performance digital signal processing and embedded processing capabilities. Furthermore, the chip model is also expected to be used in a number of research projects, demonstrating its potential for use in a wide range of applications. As such, the 5SGXEA3K3F40C2L chip model is an attractive option for many applications, and its demand is expected to increase in the future.



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