
Intel Corporation
5SGXEA3K1F40C2LN
5SGXEA3K1F40C2LN ECAD Model
5SGXEA3K1F40C2LN Attributes
Type | Description | Select |
---|---|---|
Mfr | Intel | |
Series | Stratix® V GX | |
Package | Tray | |
Number of LABs/CLBs | 128300 | |
Number of Logic Elements/Cells | 340000 | |
Total RAM Bits | 19456000 | |
Number of I/O | 696 | |
Voltage - Supply | 0.82V ~ 0.88V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 1517-BBGA, FCBGA | |
Supplier Device Package | 1517-FBGA (40x40) | |
Base Product Number | 5SGXEA3 |
5SGXEA3K1F40C2LN Datasheet Download
5SGXEA3K1F40C2LN Overview
The chip model 5SGXEA3K1F40C2LN is an important part of the semiconductor industry and has been widely used in many applications, such as automotive, consumer electronics, and communications. As the industry continues to evolve, the chip model 5SGXEA3K1F40C2LN is becoming increasingly important.
The chip model 5SGXEA3K1F40C2LN is a high-performance, low-power, and low-cost solution that supports a wide range of applications. The model features a high-performance, low-power, and low-cost architecture that is designed to meet the needs of a variety of applications. The model is designed for high-speed, low-power, and low-cost applications, such as automotive, consumer electronics, and communications.
The chip model 5SGXEA3K1F40C2LN is designed to meet the needs of a variety of applications, such as automotive, consumer electronics, and communications. It features a high-performance, low-power, and low-cost architecture that is designed to meet the needs of a variety of applications. It also supports a wide range of applications with its high-speed, low-power, and low-cost architecture.
The chip model 5SGXEA3K1F40C2LN is designed to meet the needs of a variety of applications, such as automotive, consumer electronics, and communications. It offers a wide range of features, such as high-speed, low-power, and low-cost architecture, that make it an ideal choice for a variety of applications. In addition, the chip model 5SGXEA3K1F40C2LN is designed to be compatible with a wide range of technologies, such as Bluetooth, Wi-Fi, and Zigbee.
The chip model 5SGXEA3K1F40C2LN can be used in the development and popularization of future intelligent robots, as it supports a wide range of technologies. It is designed to be compatible with a wide range of technologies, such as Bluetooth, Wi-Fi, and Zigbee, which are essential for the development and implementation of intelligent robots. In addition, the chip model 5SGXEA3K1F40C2LN is designed to be compatible with a wide range of programming languages, such as C++ and Java, which are necessary for the development of intelligent robots.
The chip model 5SGXEA3K1F40C2LN is designed to be used by technical talents who have a good understanding of the industry trends and the future development of related industries. The chip model 5SGXEA3K1F40C2LN requires a thorough understanding of the product description and specific design requirements, as well as actual case studies and precautions. In addition, technical talents must understand the application environment and whether the application environment requires the support of new technologies, such as artificial intelligence (AI) or machine learning (ML).
In conclusion, the chip model 5SGXEA3K1F40C2LN is an important part of the semiconductor industry and can be used in the development and popularization of future intelligent robots. It is designed to meet the needs of a variety of applications, such as automotive, consumer electronics, and communications. It features a high-performance, low-power, and low-cost architecture that is designed to meet the needs of a variety of applications. In addition, it is designed to be compatible with a wide range of technologies, such as Bluetooth, Wi-Fi, and Zigbee, as well as a wide range of programming languages, such as C++ and Java. Technical talents who have a good understanding of the industry trends and the future development of related industries are needed to use the model effectively.
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